LOGITECH

1WBT2

Logitech 1WBT2 4" Wafer Substrate Bonding Unit/Bonder

***This unit has 2 of the bonding stations removed but I believe it will still function as a single unit. Each bonding unit costs about $6500.00 from the manufacturer to replace.***

Key Features:
  Automated process cycle minimizes operator input
  Excellent wafer to support disc parallelism
  Touch button control of bonding parameters
  Bubble free bond
  4" (102 mm) wafer capacity
  Single or multiple wafer capacity (technically this unit is a single unit cause the other 2 stations are removed)

Description:
Bonding techniques for processing thin and fragile II-VI and III-V semiconductor wafers such as silicon, GaAs and InP require delicate handling procedures. Laboratories bonding such materials need to maintain the highest quality of sample yield and minimize breakage of these expensive materials in wafer preparation process.

The Logitech Wafer Substrate Bonding Unit has been designed to meet such stringent requirements. This highly automated machine incorporates both vacuum and pressure bonding facilities. It allows the operator to  mount and bond up to three part or whole wafers up to a diameter of 4" (102 mm) prior to further processing. The system produces consistently high standards of wafers to support disc parallelism, irrespective of whether one large wafer or a number of smaller wafers of differing thickness are being mounted and bonded. Touch button control of the process display on the machine's front panel allows all process parameters to be accurately controlled. This includes a programmable bonding temperature and vacuum to produce the required environment for a specific sample type.

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Key Features:
-Automated process cycle minimizes operator input
-Excellent wafer to support disc parallelism
-Touch button control of bonding parameters
-Bubble free bond
-4" (102 mm) wafer capacity
-Single or multiple wafer capacity (technically this unit is a single unit cause the other 2 stations are removed)

Description:
Bonding techniques for processing thin and fragile II-VI and III-V semiconductor wafers such as silicon, GaAs and InP require delicate handling procedures. Laboratories bonding such materials need to maintain the highest quality of sample yield and minimize breakage of these expensive materials in wafer preparation process.

The Logitech Wafer Substrate Bonding Unit has been designed to meet such stringent requirements. This highly automated machine incorporates both vacuum and pressure bonding facilities. It allows the operator to  mount and bond up to three part or whole wafers up to a diameter of 4" (102 mm) prior to further processing. The system produces consistently high standards of wafers to support disc parallelism, irrespective of whether one large wafer or a number of smaller wafers of differing thickness are being mounted and bonded. Touch button control of the process display on the machine's front panel allows all process parameters to be accurately controlled. This includes a programmable bonding temperature and vacuum to produce the required environment for a specific sample type.

1WBT2

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1WBT2

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