説明
Grinding machine構成
構成なしOEMモデルの説明
The W-GM-4200 is an edge grinding machine for wafer manufacturing up to 200 mm in diameter. It is produced by ACCRETECH and has a wide scope of application, high grinding precision, compact design, and is easy to operate. It is suitable for various wafer materials, such as GaAs, SiC, GaN, etc. The machine has a newly developed grinding unit for better rotational precision of the spindle and the profile sharpness.ドキュメント
ドキュメントなし
カテゴリ
Wafer Grinding
最終検証： 9日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
153698
ウェーハサイズ：
不明
ヴィンテージ：
不明
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
ACCRETECH / TOSEI
W-GM-4200
カテゴリ
Wafer Grinding
最終検証： 9日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
153698
ウェーハサイズ：
不明
ヴィンテージ：
不明
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Grinding machine構成
構成なしOEMモデルの説明
The W-GM-4200 is an edge grinding machine for wafer manufacturing up to 200 mm in diameter. It is produced by ACCRETECH and has a wide scope of application, high grinding precision, compact design, and is easy to operate. It is suitable for various wafer materials, such as GaAs, SiC, GaN, etc. The machine has a newly developed grinding unit for better rotational precision of the spindle and the profile sharpness.ドキュメント
ドキュメントなし