説明
ACCRETECH also offers the "RM option", having the additional process of the tape removing for thinner wafer after the tape mounting, in addition to the standard process of PG300/200. nThe RM200/300 offers a single-unit solution supplementing PG200/300 processing with additional functionality to remove protective tape from thinner wafers and apply wafers to dicing frames. nPerforms the processes of the rough grinding, fine grinding, polishing and cleaning wafers on the both sides in a single machine. nAll the processes are completed without moving the wafer on the same chuck table. nThe smallest footprint in the world. nEnvironmental - friendly - subsurface damage reduction without chemicals. nEnvironmental - friendly - subsurface damage reduction without chemicals.構成
PG3000RM/200RMOEMモデルの説明
提供なしドキュメント
ドキュメントなし
ACCRETECH / TSK
PG3000RM
検証済み
カテゴリ
Wafer Grinding
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
79210
ウェーハサイズ：
不明
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ACCRETECH / TSK
PG3000RM
カテゴリ
Wafer Grinding
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
79210
ウェーハサイズ：
不明
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
ACCRETECH also offers the "RM option", having the additional process of the tape removing for thinner wafer after the tape mounting, in addition to the standard process of PG300/200. nThe RM200/300 offers a single-unit solution supplementing PG200/300 processing with additional functionality to remove protective tape from thinner wafers and apply wafers to dicing frames. nPerforms the processes of the rough grinding, fine grinding, polishing and cleaning wafers on the both sides in a single machine. nAll the processes are completed without moving the wafer on the same chuck table. nThe smallest footprint in the world. nEnvironmental - friendly - subsurface damage reduction without chemicals. nEnvironmental - friendly - subsurface damage reduction without chemicals.構成
PG3000RM/200RMOEMモデルの説明
提供なしドキュメント
ドキュメントなし