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説明
説明なし構成
構成なしOEMモデルの説明
The MPC™ 2000 Integrated Circuit Cross-Sectioning Semi Automated System is designed to accurately remove a pre-specified amount of material from microelectronic devices, and micro-components. Accurate cross-sectioning within +/-1um of a target feature is possible due to a combination of the precision power head, the low run-out tri-point drive plate, and the lapped, stainless-steel precision platen.This high accuracy reduces the possibility of grinding beyond the target plane which would be detrimental in failure analysis work.ドキュメント
ドキュメントなし
カテゴリ
Wafer Grinding
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
68020
ウェーハサイズ：
不明
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Bühler / BUEHLER
MPC 2000
カテゴリ
Wafer Grinding
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
68020
ウェーハサイズ：
不明
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
説明なし構成
構成なしOEMモデルの説明
The MPC™ 2000 Integrated Circuit Cross-Sectioning Semi Automated System is designed to accurately remove a pre-specified amount of material from microelectronic devices, and micro-components. Accurate cross-sectioning within +/-1um of a target feature is possible due to a combination of the precision power head, the low run-out tri-point drive plate, and the lapped, stainless-steel precision platen.This high accuracy reduces the possibility of grinding beyond the target plane which would be detrimental in failure analysis work.ドキュメント
ドキュメントなし