DAG810
カテゴリ
Wafer Grinding概要（Overview）
The Disco DAG810 is a compact, automatic grinder for workpieces up to 8 inches in diameter. It has one spindle and one chuck table and is designed to process a variety of materials. It has a relatively small footprint of only 11 square feet.
現在の掲載品
3
サービス
検査、保証、鑑定、ロジスティクス
