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説明
Basic specifications: Workpiece diameter the machine can handle = Maximim 8" 4/5/6/8 when the universal check table is used. Workpiece thickness the machine can handle = Maximum 20 mm Grinding system = In-feed grinding by rotating workpiece Grinding wheel used = 20 mm (8'') diamond wheel Spindle section: Bearing type: Air bearing Number of axes: 1 Motor: 4.2 kw high-frequency motor Motor electric current: Displayed in real time on the monitor (with peak-hold function) Rotative speed: 1,000 to 7,000 min -1 Rotative speed command unit: 1 min -1構成
構成なしOEMモデルの説明
The Disco DAG810 is a compact, automatic grinder for workpieces up to 8 inches in diameter. It has one spindle and one chuck table and is designed to process a variety of materials. It has a relatively small footprint of only 11 square feet.ドキュメント
同様のリスト
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DISCO
DAG810
カテゴリ
Wafer Grinding
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
110343
ウェーハサイズ：
不明
ヴィンテージ：
2012
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