DFG840
カテゴリ
Wafer Grinding概要(Overview)
The Disco DFG840 and 841 Systems have two-spindle, two-chuck table specifications and a robot arm. These machines feature a same-cassette return function. The robot arm vacuum ensures that even thin-ground wafers, which are prone to warping, are corrected to the required flatness for trouble-free handling.
現在の掲載品
8
サービス
検査、保証、鑑定、ロジスティクス