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DISCO DFG840
    説明
    Slicer Cutter Disco dfg840, a classic 8-inch wafer grinding equipment, can be compatible with 4-5-6-inch wafer. The equipment has good stability. The company has a professional after-sales team to provide relevant installation, commissioning and maintenance services. Rated power: ac200v, 50 / 60Hz, 17kwv Compressed air: 0.5MPa 300l/mi Grinding water: 0.2MPa 15L / min L cooling water: 0.2MPa 11L / min Weight: 2300kg
    構成
    構成なし
    OEMモデルの説明
    The Disco DFG840 and 841 Systems have two-spindle, two-chuck table specifications and a robot arm. These machines feature a same-cassette return function. The robot arm vacuum ensures that even thin-ground wafers, which are prone to warping, are corrected to the required flatness for trouble-free handling.
    ドキュメント

    ドキュメントなし

    DISCO

    DFG840

    verified-listing-icon

    検証済み

    カテゴリ
    Wafer Grinding

    最終検証: 60日以上前

    主なアイテムの詳細

    状態:

    Used


    稼働ステータス:

    不明


    製品ID:

    79146


    ウェーハサイズ:

    不明


    ヴィンテージ:

    不明


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    同様のリスト
    すべて表示
    DISCO DFG840

    DISCO

    DFG840

    Wafer Grinding
    ヴィンテージ: 1995状態: 中古
    最終確認15日前

    DISCO

    DFG840

    verified-listing-icon
    検証済み
    カテゴリ
    Wafer Grinding
    最終検証: 60日以上前
    listing-photo-0f396aa2fdb846a89125ca1a2f6e60b6-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1955/0f396aa2fdb846a89125ca1a2f6e60b6/3a3b2b23e7c244a7b44e9508866d35f0_dfg8401_mw.png
    listing-photo-0f396aa2fdb846a89125ca1a2f6e60b6-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1955/0f396aa2fdb846a89125ca1a2f6e60b6/ba60c7283bfc44908a69421bde45bb32_dfg8402_mw.png
    主なアイテムの詳細

    状態:

    Used


    稼働ステータス:

    不明


    製品ID:

    79146


    ウェーハサイズ:

    不明


    ヴィンテージ:

    不明


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    説明
    Slicer Cutter Disco dfg840, a classic 8-inch wafer grinding equipment, can be compatible with 4-5-6-inch wafer. The equipment has good stability. The company has a professional after-sales team to provide relevant installation, commissioning and maintenance services. Rated power: ac200v, 50 / 60Hz, 17kwv Compressed air: 0.5MPa 300l/mi Grinding water: 0.2MPa 15L / min L cooling water: 0.2MPa 11L / min Weight: 2300kg
    構成
    構成なし
    OEMモデルの説明
    The Disco DFG840 and 841 Systems have two-spindle, two-chuck table specifications and a robot arm. These machines feature a same-cassette return function. The robot arm vacuum ensures that even thin-ground wafers, which are prone to warping, are corrected to the required flatness for trouble-free handling.
    ドキュメント

    ドキュメントなし

    同様のリスト
    すべて表示
    DISCO DFG840

    DISCO

    DFG840

    Wafer Grindingヴィンテージ: 1995状態: 中古最終検証:15日前
    DISCO DFG840

    DISCO

    DFG840

    Wafer Grindingヴィンテージ: 0状態: 中古最終検証:60日以上前
    DISCO DFG840

    DISCO

    DFG840

    Wafer Grindingヴィンテージ: 0状態: 中古最終検証:60日以上前