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DISCO DFG8540
    説明
    説明なし
    構成
    Specification Unit DFG8540 DFG8560 Wafer diameter - 08" 300 (04"/5"/6"/8") (0 200/ 300) Grinding method - In-feed grinding with wafer Rotation Griding wheels mm 200( 8") 300 Diamond wheel Diamond wheel Rated output kW 4.2 4.8 Spindle Rated torqu min 1,000 ~ 4,000 1,000 ~ 7,000 range Grinding Accuracy BG Thickness 1.5 or less 3.0 or less variation within one wafer um (with dedicated (with dedicated chuck table) chuck table, 300mm wafer Thickness variation between wafers um +3.0 or less Finished Ry 0.13(with #2000 finish) surface um Ry 0.15(with #1400 finish) roughness Machine mm 1,200 x 2,670 1,400 x 3,322 dimensions(WxDxH) x 1,800 x 1,800 Machine Weight: Kg Approx.3,100 Approx. 4,000
    OEMモデルの説明
    The Disco DFG8540 is a fully automatic in-feed surface grinder. It has a conventional two-spindle, three-chuck design and is capable of performing both large diameter and thin-finish grinding. The processing position of the grinding wheel coincides with the chuck table for each spindle for improved grinding performance. The Disco DFG8540 supports workpiece sizes up to Φ8 inch and uses a Φ200 mm Diamond Wheel for grinding. The spindle has a rated output of 4.2 kW and a rotation speed range of 1,000 to 7,000 min-1. The equipment dimensions are 1,200 × 2,670 × 1,800 mm and it weighs approximately 3,100 kg.
    ドキュメント

    DISCO

    DFG8540

    verified-listing-icon

    検証済み

    カテゴリ
    Wafer Grinding

    最終検証: 60日以上前

    主なアイテムの詳細

    状態:

    Used


    稼働ステータス:

    不明


    製品ID:

    79160


    ウェーハサイズ:

    不明


    ヴィンテージ:

    不明


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    同様のリスト
    すべて表示
    DISCO DFG8540

    DISCO

    DFG8540

    Wafer Grinding
    ヴィンテージ: 2015状態: 中古
    最終確認60日以上前

    DISCO

    DFG8540

    verified-listing-icon
    検証済み
    カテゴリ
    Wafer Grinding
    最終検証: 60日以上前
    listing-photo-5fbf1496df0e471395013073b3febdf6-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    主なアイテムの詳細

    状態:

    Used


    稼働ステータス:

    不明


    製品ID:

    79160


    ウェーハサイズ:

    不明


    ヴィンテージ:

    不明


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    説明
    説明なし
    構成
    Specification Unit DFG8540 DFG8560 Wafer diameter - 08" 300 (04"/5"/6"/8") (0 200/ 300) Grinding method - In-feed grinding with wafer Rotation Griding wheels mm 200( 8") 300 Diamond wheel Diamond wheel Rated output kW 4.2 4.8 Spindle Rated torqu min 1,000 ~ 4,000 1,000 ~ 7,000 range Grinding Accuracy BG Thickness 1.5 or less 3.0 or less variation within one wafer um (with dedicated (with dedicated chuck table) chuck table, 300mm wafer Thickness variation between wafers um +3.0 or less Finished Ry 0.13(with #2000 finish) surface um Ry 0.15(with #1400 finish) roughness Machine mm 1,200 x 2,670 1,400 x 3,322 dimensions(WxDxH) x 1,800 x 1,800 Machine Weight: Kg Approx.3,100 Approx. 4,000
    OEMモデルの説明
    The Disco DFG8540 is a fully automatic in-feed surface grinder. It has a conventional two-spindle, three-chuck design and is capable of performing both large diameter and thin-finish grinding. The processing position of the grinding wheel coincides with the chuck table for each spindle for improved grinding performance. The Disco DFG8540 supports workpiece sizes up to Φ8 inch and uses a Φ200 mm Diamond Wheel for grinding. The spindle has a rated output of 4.2 kW and a rotation speed range of 1,000 to 7,000 min-1. The equipment dimensions are 1,200 × 2,670 × 1,800 mm and it weighs approximately 3,100 kg.
    ドキュメント
    同様のリスト
    すべて表示
    DISCO DFG8540

    DISCO

    DFG8540

    Wafer Grindingヴィンテージ: 2015状態: 中古最終検証:60日以上前
    DISCO DFG8540

    DISCO

    DFG8540

    Wafer Grindingヴィンテージ: 2007状態: 中古最終検証:60日以上前
    DISCO DFG8540

    DISCO

    DFG8540

    Wafer Grindingヴィンテージ: 0状態: 中古最終検証:60日以上前