説明
Fully Automatic Taiko-Grinding System designed for high-precision thinning of semiconductor wafers Key Features: 2 Low Vibration Air Bearing Spindles 2 Probe Height Gauges for Measuring Automatic wheel set-up function Edge clamping on transfer arms 2 and 3 instead of vacuum pads Fixed-position stop function for the chuck table and spinner table In-process wafer thickness measurement on Z1 and Z2 Non-Contact Thickness Gauge for normal and high doped wafers Non-recirculating Cutting and Cleaning Water System Reserve air switching unit for spindle air bearing protection Robotic Wafer Transportation System Signal Tower Spindle Cooling Water System Spindle Rotation Speed Monitor T2-arm with vacuum pad, not edge clamping Taiko-grinding of 8”-wafers with V-notch Transfer arm 3 (T-arm in spinner table area) with vacuum pad for 8” wafers with V-Notc Turntable with 3 Chuck Tables for 8”-wafers with V-notch Vacuum maintenance using vacuum ejector Vacuum Pump System Wafer Cleaner with spinner table Z-Axis Indices Wafer backside washing function Vacuum maintenance using vacuum ejector SECS/HSMS構成
構成なしOEMモデルの説明
The DISCO DTG8440 is a fully automatic Taiko grinder manufactured by DISCO Corporation.ドキュメント
ドキュメントなし
同様のリスト
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DISCO
DTG8440
カテゴリ
Wafer Grinding
最終検証： 18日前
主なアイテムの詳細
状態：
New
稼働ステータス:
不明
製品ID：
152148
ウェーハサイズ：
8"/200mm
ヴィンテージ：
2025
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Fully Automatic Taiko-Grinding System designed for high-precision thinning of semiconductor wafers Key Features: 2 Low Vibration Air Bearing Spindles 2 Probe Height Gauges for Measuring Automatic wheel set-up function Edge clamping on transfer arms 2 and 3 instead of vacuum pads Fixed-position stop function for the chuck table and spinner table In-process wafer thickness measurement on Z1 and Z2 Non-Contact Thickness Gauge for normal and high doped wafers Non-recirculating Cutting and Cleaning Water System Reserve air switching unit for spindle air bearing protection Robotic Wafer Transportation System Signal Tower Spindle Cooling Water System Spindle Rotation Speed Monitor T2-arm with vacuum pad, not edge clamping Taiko-grinding of 8”-wafers with V-notch Transfer arm 3 (T-arm in spinner table area) with vacuum pad for 8” wafers with V-Notc Turntable with 3 Chuck Tables for 8”-wafers with V-notch Vacuum maintenance using vacuum ejector Vacuum Pump System Wafer Cleaner with spinner table Z-Axis Indices Wafer backside washing function Vacuum maintenance using vacuum ejector SECS/HSMS構成
構成なしOEMモデルの説明
The DISCO DTG8440 is a fully automatic Taiko grinder manufactured by DISCO Corporation.ドキュメント
ドキュメントなし