説明
説明なし構成
構成なしOEMモデルの説明
The DISCO DFG8340 is a fully automatic in-feed surface grinder designed for high-precision wafer processing. It features a single spindle, dual chuck table, and single turntable structure, enabling efficient grinding of various workpieces up to 8 inches in diameter, including silicon wafers, SiC, sapphire, and ceramics. This grinder is particularly suitable for applications requiring high planarity, such as semiconductor device manufacturing.ドキュメント
ドキュメントなし
DISCO
DFG8340
カテゴリ
Wafer Grinding
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
126262
ウェーハサイズ：
不明
ヴィンテージ：
不明
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
説明なし構成
構成なしOEMモデルの説明
The DISCO DFG8340 is a fully automatic in-feed surface grinder designed for high-precision wafer processing. It features a single spindle, dual chuck table, and single turntable structure, enabling efficient grinding of various workpieces up to 8 inches in diameter, including silicon wafers, SiC, sapphire, and ceramics. This grinder is particularly suitable for applications requiring high planarity, such as semiconductor device manufacturing.ドキュメント
ドキュメントなし