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説明
説明なし構成
構成なしOEMモデルの説明
Designed to grind advanced materials, such as sapphire, aluminum nitride and garnet. It is also capable of performing wafer back-side grinding operations and achieving a high degree of flatness, as well as high quality surface finishes.ドキュメント
ドキュメントなし
ENGIS
EHG-180AV
カテゴリ
Wafer Grinding
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
83278
ウェーハサイズ：
不明
ヴィンテージ：
2006
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説明
説明なし構成
構成なしOEMモデルの説明
Designed to grind advanced materials, such as sapphire, aluminum nitride and garnet. It is also capable of performing wafer back-side grinding operations and achieving a high degree of flatness, as well as high quality surface finishes.ドキュメント
ドキュメントなし