説明
説明なし構成
構成なしOEMモデルの説明
"Advanced nTellect Wafer Grinder, 7AF, renowned for reducing sub-surface damage and improving surface finish with repeatable thickness control. The nTellect Grinder boasts high volume wafer throughput at a low cost, utilizing innovative technologies such as tapeless backgrinding, in-feed technology, in-situ thickness control, force adaptive grinding, linear traversing grind spindles, automated process control, and thin wafer handling. Serving a wide array of applications including integrated circuit backgrinding, silicon on insulator, prime wafers, gallium arsenide, lithium niobate, aluminum titanium carbide for read/write heads, glass, sapphire, and quartz, the nTellect Grinder relies on near-frictionless, force-sensitive infeed mechanics and an intelligent control system, which together increase wafer strength and reduce breakage. Its ultra-stiff air bearing spindles and sub-micron feed rates deliver superior surface finishes. The Grinder also features in-situ digital measurement probes and unique linear traversing grind spindles for optimized throughput and accurate, consistent wafer thicknesses. Lastly, with the addition of Tapeless Backgrinding and ultra-fine grit grind wheels, nTellect is poised to revolutionize thin wafer applications. "ドキュメント
ドキュメントなし
検証済み
カテゴリ
Wafer Grinding
最終検証： 4日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
148419
ウェーハサイズ：
不明
ヴィンテージ：
不明
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
STRASBAUGH
7AF
カテゴリ
Wafer Grinding
最終検証： 4日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
148419
ウェーハサイズ：
不明
ヴィンテージ：
不明
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
説明なし構成
構成なしOEMモデルの説明
"Advanced nTellect Wafer Grinder, 7AF, renowned for reducing sub-surface damage and improving surface finish with repeatable thickness control. The nTellect Grinder boasts high volume wafer throughput at a low cost, utilizing innovative technologies such as tapeless backgrinding, in-feed technology, in-situ thickness control, force adaptive grinding, linear traversing grind spindles, automated process control, and thin wafer handling. Serving a wide array of applications including integrated circuit backgrinding, silicon on insulator, prime wafers, gallium arsenide, lithium niobate, aluminum titanium carbide for read/write heads, glass, sapphire, and quartz, the nTellect Grinder relies on near-frictionless, force-sensitive infeed mechanics and an intelligent control system, which together increase wafer strength and reduce breakage. Its ultra-stiff air bearing spindles and sub-micron feed rates deliver superior surface finishes. The Grinder also features in-situ digital measurement probes and unique linear traversing grind spindles for optimized throughput and accurate, consistent wafer thicknesses. Lastly, with the addition of Tapeless Backgrinding and ultra-fine grit grind wheels, nTellect is poised to revolutionize thin wafer applications. "ドキュメント
ドキュメントなし