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CHAD WLM-2300
    説明
    説明なし
    構成
    構成なし
    OEMモデルの説明
    The CHAD Wafer Loader WLM™ Series delivers significant performance and cost savings for wafer level packaging applications. This system provides fully automated wafer handling for back-end of line (BEOL) process and metrology tools. The WLM series can handle a wide range of wafer sizes (up to 300mm in diameter), wafers with active devices on both sides, thin wafers, and other types of non-standard substrates. Other features include a configurable flow direction (left or right); an ergonomic cassette elevator; various types of cassette I/O, as well as OCR and barcode reading options.
    ドキュメント

    ドキュメントなし

    CHAD

    WLM-2300

    verified-listing-icon

    検証済み

    カテゴリ
    Wafer Handling

    最終検証: 60日以上前

    主なアイテムの詳細

    状態:

    Used


    稼働ステータス:

    不明


    製品ID:

    98166


    ウェーハサイズ:

    不明


    ヴィンテージ:

    2005


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    同様のリスト
    すべて表示
    CHAD WLM-2300

    CHAD

    WLM-2300

    Wafer Handling
    ヴィンテージ: 2005状態: 中古
    最終確認60日以上前

    CHAD

    WLM-2300

    verified-listing-icon
    検証済み
    カテゴリ
    Wafer Handling
    最終検証: 60日以上前
    listing-photo-c86acb195e754bbab2a0eb1b4377172b-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    主なアイテムの詳細

    状態:

    Used


    稼働ステータス:

    不明


    製品ID:

    98166


    ウェーハサイズ:

    不明


    ヴィンテージ:

    2005


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    説明
    説明なし
    構成
    構成なし
    OEMモデルの説明
    The CHAD Wafer Loader WLM™ Series delivers significant performance and cost savings for wafer level packaging applications. This system provides fully automated wafer handling for back-end of line (BEOL) process and metrology tools. The WLM series can handle a wide range of wafer sizes (up to 300mm in diameter), wafers with active devices on both sides, thin wafers, and other types of non-standard substrates. Other features include a configurable flow direction (left or right); an ergonomic cassette elevator; various types of cassette I/O, as well as OCR and barcode reading options.
    ドキュメント

    ドキュメントなし

    同様のリスト
    すべて表示
    CHAD WLM-2300

    CHAD

    WLM-2300

    Wafer Handlingヴィンテージ: 2005状態: 中古最終検証:60日以上前