The Lapmaster 36 is a versatile machine, available in open face or pneumatic lift versions with 3 or 4 rings. It can process semiconductors, ceramics, metals, and more. Its heavy-duty steel frame and adjustable conditioning rings ensure accurate results.

LAPMASTER

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The Lapmaster model LSP-6 is a 4-way, planetary, dual face lapping and polishing machine with a sophisticated control system. It can execute complex lapping and polishing routines while producing precise and repeatable results. The LSP-6 is able to process extremely thin, fragile components to very tight tolerances repeatably. The machine is initially configurated to handle either 66-tooth (140mm/5.5” pitch diameter) or 50-tooth (107mm/4.2” pitch diameter) work carriers, and is easily converted between either configuration. Operation is governed by a programmable controller. Custom software prompts the operator for specific operating parameters and stores up to 10 routines for recall as needed. Password protection is available to restrict access to programming or program selection. Through a load cell, the controller continually monitors and adjusts the top plate weight to maintain constant pressure on the parts. The LSP-6 has a unique combination of pneumatic pressure controls, frame design, and load control algorithms produce the most accurate and repeatable tolerance results in the industry. The five carriers are gear driven for smooth action while lapping thin, fragile parts. In the 66-tooth carrier configuration, the machine holds 5 carriers and can lap or polish most parts down to .076mm/.003” thick. In the 50-tooth carrier configuration, the machine holds 8 carriers and can lap or polish most parts down to .051mm/.002” thick. Plates and carrier speeds are varied through AC frequency inverters. The machine is built on a box beam frame and the top plate is supported from a frame bridge for stability and durability. 

Wafer Lapping

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Wafer Lapping のメーカー

Wafer Lapping のトップ製品

36

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LSP-6

SP-888-36 PNLC