The EJD-9BL is a double-sided polishing machine that belongs to the EJD series. It supports a wide range of lapping and CMP processing of conventional abrasives, diamond abrasive, and fixed abrasive plates. The standard full safety cover makes it suitable for use in a semiconductor manufacturing environment. Additionally, it comes with a variety of optional functions such as real-time part thickness detection, actual pressure monitor and control, and low-pressure, low-speed descent control of the upper surface lapping platen. These features are essential for simultaneous double-sided polishing of thin wafers.

ENGIS

EJD-9BL

EJ-380IN

EJW-460IFN

36SFL60VP-01

FL-24V

Fast Lap Lapping and Polishing Machine with Engis Hyprez Auto stirrer with Speed Control

15FL110v

Lap Plate Diameter	15" 381 mm
Maximum part Diameter (inside work ring): 5-7/16" 138 mm
Work Stations/Rings: 3
Maximum Plate Speed: 90 rpm

ENGIS

概要（Overview）

現在の掲載品

全ての製品

サービス

トップENGIS Wafer Lapping

EJD-9BL

EJ-380IN

EJW-460IFN

36SFL60VP-01

Moovに掲載品して、すぐに申し分ない購入者を見つけましょう。

すべてのENGIS Wafer Lapping