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6BN-3M5L
カテゴリ
Wafer Lapping概要（Overview）
Double-side lapping machine, Patented upper plate flex-link system (wire suspension), CPU controlled variable pneumatic pressure system (total load ~ 14kg (30.8 lbs) Touch screen control system (display is INCH units…if METRIC units required, please advise) Upper plate air cylinder stoke: 160mm Automatic thickness measuring by scale system. Three (3) independent drive motors with variable speed/direction control. Multiple position ring gear (20mm)
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