DGP8760
カテゴリ
Wafer Polishing概要（Overview）
The DGP8760 is a fully automatic grinder/polisher for Φ300 mm wafers developed by DISCO Corporation. It is the predecessor to the DGP8761, which integrates backside grinding and stress relief processing and performs stable thin grinding to thicknesses less than 25 µm.
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検査、保証、鑑定、ロジスティクス
