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+DFM2700OEMモデルの説明
The DGP8760 is a fully automatic grinder/polisher for Φ300 mm wafers developed by DISCO Corporation. It is the predecessor to the DGP8761, which integrates backside grinding and stress relief processing and performs stable thin grinding to thicknesses less than 25 µm.ドキュメント
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DISCO
DGP8760
カテゴリ
Wafer Polishing
最終検証： 10日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
125959
ウェーハサイズ：
8"/200mm, 12"/300mm
ヴィンテージ：
2006
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説明
説明なし構成
+DFM2700OEMモデルの説明
The DGP8760 is a fully automatic grinder/polisher for Φ300 mm wafers developed by DISCO Corporation. It is the predecessor to the DGP8761, which integrates backside grinding and stress relief processing and performs stable thin grinding to thicknesses less than 25 µm.ドキュメント
ドキュメントなし