概要（Overview）

CMP polisher designed to process hard-to-process materials such as sapphire and SiC Φ200 mm 1 axis, 2 chuck tables Wafer Thinning Stress Releaf Fully automatic operation The DFP8141 is a fully automatic polisher which performs CMP processing from cassette to cassette. With the installation of a cleaning station, wafer cleaning and drying after processing are performed automatically. For small workpieces made of difficult-to-process materials The DFP8141 supports CMP for materials such as sapphire, SiC, LT, and LN.