説明
説明なし構成
構成なしOEMモデルの説明
CMP polisher designed to process hard-to-process materials such as sapphire and SiC Φ200 mm 1 axis, 2 chuck tables Wafer Thinning Stress Releaf Fully automatic operation The DFP8141 is a fully automatic polisher which performs CMP processing from cassette to cassette. With the installation of a cleaning station, wafer cleaning and drying after processing are performed automatically. For small workpieces made of difficult-to-process materials The DFP8141 supports CMP for materials such as sapphire, SiC, LT, and LN.ドキュメント
ドキュメントなし
DISCO
DFP8141
検証済み
カテゴリ
Wafer Polishing
最終検証: 30日以上前
主なアイテムの詳細
状態:
Used
稼働ステータス:
不明
製品ID:
112290
ウェーハサイズ:
不明
ヴィンテージ:
2023
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
DISCO
DFP8141
カテゴリ
Wafer Polishing
最終検証: 30日以上前
主なアイテムの詳細
状態:
Used
稼働ステータス:
不明
製品ID:
112290
ウェーハサイズ:
不明
ヴィンテージ:
2023
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
説明なし構成
構成なしOEMモデルの説明
CMP polisher designed to process hard-to-process materials such as sapphire and SiC Φ200 mm 1 axis, 2 chuck tables Wafer Thinning Stress Releaf Fully automatic operation The DFP8141 is a fully automatic polisher which performs CMP processing from cassette to cassette. With the installation of a cleaning station, wafer cleaning and drying after processing are performed automatically. For small workpieces made of difficult-to-process materials The DFP8141 supports CMP for materials such as sapphire, SiC, LT, and LN.ドキュメント
ドキュメントなし