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説明
Multi-Process CMP構成
Standard Features Include: - Automated control with soft touch key pad - Two platen process for post polish buff - Multiple slurry dispense - In-situ pad conditioner - Material compatibility for medium and low ph slurries (1 – 12) - Down force up to 750lbs. - Controllable wafer back pressure - Polish head clean station - External interface for end point capability Optional Features - Multizone ViPRR carrier upgrade - Temperature controlled platens - SECS II InterfaceOEMモデルの説明
提供なしドキュメント
ドキュメントなし
カテゴリ
Wafer Polishing
最終検証： 30日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
83267
ウェーハサイズ：
8"/200mm
ヴィンテージ：
1997
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
IPEC / WESTECH
AVANTI 372M
カテゴリ
Wafer Polishing
最終検証： 30日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
83267
ウェーハサイズ：
8"/200mm
ヴィンテージ：
1997
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Multi-Process CMP構成
Standard Features Include: - Automated control with soft touch key pad - Two platen process for post polish buff - Multiple slurry dispense - In-situ pad conditioner - Material compatibility for medium and low ph slurries (1 – 12) - Down force up to 750lbs. - Controllable wafer back pressure - Polish head clean station - External interface for end point capability Optional Features - Multizone ViPRR carrier upgrade - Temperature controlled platens - SECS II InterfaceOEMモデルの説明
提供なしドキュメント
ドキュメントなし