説明
Logitech CDP 1CM53 Chemical Delayering & Planarization CMP Polisher System ***This unit looks to be in great condition. It was excess stock from a refurbishment company. There are 2 connectors that are not plugged in to anything in the bottom. We do not have the facility requirements or expertise to test this unit. We are selling it as-is, for parts or not working as such.*** Key Features: Minimal subsurface damage Wide range of wafer sizes can be polished, up to 200 mm to single integrated circuit (IC) capability Robust, corrosion resistant construction Fine etch polishing of semiconductor wafers and electro-optic crystals Automated process control for repeatable results Description: The CDP automatic allows the operator to achieve industry standards of control and layer removal for traditional CMOS technology, CMP applications, such as STI and Damascene (acceptable Within Wafer Non-Uniformity (WIWNU) and Within Die Non-Uniformity (WIDNU) are achievable). The CDP automatic can also be used for non-traditional planarisation applications, such as hard substrate polishing, Epi-ready surface preparation or wafer reclamation, and will produce accurate and repeatable results to within required measurement parameters. Laser quality surfaces (0/0 scratch dig), improvements to surface topography and Ra to subnanometer levels on substrates are all achievable using the CDP automatic. This level of diversity makes the CDP ideal for the testing of new CMP slurries, pads and templates for off line analysis and for off line trials of new CMP processes without the need to stop production runs. Various process parameters such as: Platen rotational speed Carrier rotational speed, down force, and back pressure Carrier sweep speed and linear travel Platen temperature Slurry flow rate In-situ conditioning of the polishing pad Multiple memory locations for process storage構成
Model Number: 1CM53 Power Requirements: 220-240 VAC, 50-60 Hz, Single Phase, 10 A CE Marked: Yes Additional Information: Platen Size: 19.625"~ Dia. Holder Size: 5"~ Dia. (I believe this is correct. I measured in between 2 white polymer plastic pieces.)OEMモデルの説明
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LOGITECH
1CM53
カテゴリ
Wafer Polishing
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
Deinstalled / Uncrated
製品ID：
128815
ウェーハサイズ：
不明
ヴィンテージ：
不明
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Logitech CDP 1CM53 Chemical Delayering & Planarization CMP Polisher System ***This unit looks to be in great condition. It was excess stock from a refurbishment company. There are 2 connectors that are not plugged in to anything in the bottom. We do not have the facility requirements or expertise to test this unit. We are selling it as-is, for parts or not working as such.*** Key Features: Minimal subsurface damage Wide range of wafer sizes can be polished, up to 200 mm to single integrated circuit (IC) capability Robust, corrosion resistant construction Fine etch polishing of semiconductor wafers and electro-optic crystals Automated process control for repeatable results Description: The CDP automatic allows the operator to achieve industry standards of control and layer removal for traditional CMOS technology, CMP applications, such as STI and Damascene (acceptable Within Wafer Non-Uniformity (WIWNU) and Within Die Non-Uniformity (WIDNU) are achievable). The CDP automatic can also be used for non-traditional planarisation applications, such as hard substrate polishing, Epi-ready surface preparation or wafer reclamation, and will produce accurate and repeatable results to within required measurement parameters. Laser quality surfaces (0/0 scratch dig), improvements to surface topography and Ra to subnanometer levels on substrates are all achievable using the CDP automatic. This level of diversity makes the CDP ideal for the testing of new CMP slurries, pads and templates for off line analysis and for off line trials of new CMP processes without the need to stop production runs. Various process parameters such as: Platen rotational speed Carrier rotational speed, down force, and back pressure Carrier sweep speed and linear travel Platen temperature Slurry flow rate In-situ conditioning of the polishing pad Multiple memory locations for process storage構成
Model Number: 1CM53 Power Requirements: 220-240 VAC, 50-60 Hz, Single Phase, 10 A CE Marked: Yes Additional Information: Platen Size: 19.625"~ Dia. Holder Size: 5"~ Dia. (I believe this is correct. I measured in between 2 white polymer plastic pieces.)OEMモデルの説明
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ドキュメントなし