The SHUWA SW-08P is a single-side polishing machine designed for precision polishing applications. It features a polishing plate that rotates at speeds up to 150 rpm, facilitating efficient polishing processes. The machine is equipped with an upper spindle oscillation mechanism and a drive mechanism, enhancing its polishing capabilities. Additionally, it includes an air cylinder pressure mechanism and a vacuum chuck mechanism, allowing for secure workpiece fixation during polishing. The SW-08P also offers automatic rotation speed switching and upper spindle pressure adjustment, providing flexibility to accommodate various polishing requirements.

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トップSHUWA Wafer Polishing

SW-08P

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すべてのSHUWA Wafer Polishing