SW-08P
カテゴリ
Wafer Polishing概要(Overview)
The SHUWA SW-08P is a single-side polishing machine designed for precision polishing applications. It features a polishing plate that rotates at speeds up to 150 rpm, facilitating efficient polishing processes. The machine is equipped with an upper spindle oscillation mechanism and a drive mechanism, enhancing its polishing capabilities. Additionally, it includes an air cylinder pressure mechanism and a vacuum chuck mechanism, allowing for secure workpiece fixation during polishing. The SW-08P also offers automatic rotation speed switching and upper spindle pressure adjustment, providing flexibility to accommodate various polishing requirements.
現在の掲載品
0
サービス
検査、保証、鑑定、ロジスティクス
トップ掲載リスト
- 製品が見つかりません