説明
説明なし構成
構成なしOEMモデルの説明
The DSS 200 Series II is a double-sided PVA scrubber that offers production-proven cleaning results for particles as small as 0.125µm. It can process wafers from 150mm to 200mm, with throughputs of 45-65 wafers per hour, making it a cost-effective wafer cleaning system. The system uses a simple brush scrubbing process to clean wafers, with both sides of the wafer being cleaned simultaneously and no edge exclusion. The unit features edge-only contact and an optional megasonic rinse sweep for effective cleaning results on metals and surface topography. A heat lamp assembly allows for fast dry cycles, with typical results showing a 200mm wafer can be dried in under 15 seconds using only an 1800 rpm spin cycle. At the end of the process, wafers are removed and placed in the output cassette by an edge gripping unload handler, with no contact of the wafer front or backside occurring from the spin module to the output cassette.ドキュメント
ドキュメントなし
LAM RESEARCH CORPORATION
ONTRAK DSS200 II
検証済み
カテゴリ
Wafer Scrubber
最終検証： 30日以上前
主なアイテムの詳細
状態：
Refurbished
稼働ステータス:
不明
製品ID：
68745
ウェーハサイズ：
不明
ヴィンテージ：
1999
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
LAM RESEARCH CORPORATION
ONTRAK DSS200 II
カテゴリ
Wafer Scrubber
最終検証： 30日以上前
主なアイテムの詳細
状態：
Refurbished
稼働ステータス:
不明
製品ID：
68745
ウェーハサイズ：
不明
ヴィンテージ：
1999
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
説明なし構成
構成なしOEMモデルの説明
The DSS 200 Series II is a double-sided PVA scrubber that offers production-proven cleaning results for particles as small as 0.125µm. It can process wafers from 150mm to 200mm, with throughputs of 45-65 wafers per hour, making it a cost-effective wafer cleaning system. The system uses a simple brush scrubbing process to clean wafers, with both sides of the wafer being cleaned simultaneously and no edge exclusion. The unit features edge-only contact and an optional megasonic rinse sweep for effective cleaning results on metals and surface topography. A heat lamp assembly allows for fast dry cycles, with typical results showing a 200mm wafer can be dried in under 15 seconds using only an 1800 rpm spin cycle. At the end of the process, wafers are removed and placed in the output cassette by an edge gripping unload handler, with no contact of the wafer front or backside occurring from the spin module to the output cassette.ドキュメント
ドキュメントなし