説明
SEZ - LAM Davinci DV-34BF Backside Wet Etch System 300 mm構成
構成なしOEMモデルの説明
The DV-34BF is part of the Da Vinci Series, a single-wafer processing technology platform designed for high-volume manufacturing. It addresses new cleaning requirements for polymer removal and backside etch and clean, providing high-throughput and accurate wafer cleaning to maximize device yields. The four-chamber system performs a wide range of back-and frontside processes on 300 mm wafers and is optimized for emerging technologies such as high-k dielectrics, new metal gates, and non-volatile memory devices. It offers optimized process performance, high throughput, minimized footprint, advanced handling, reduced media consumption, flexible chemistry application, higher reliability, resulting in low CoO.ドキュメント
ドキュメントなし
LAM RESEARCH / SEZ
DV-34BF
検証済み
カテゴリ
Wet Etch
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
105212
ウェーハサイズ：
12"/300mm
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
LAM RESEARCH / SEZ
DV-34BF
カテゴリ
Wet Etch
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
105212
ウェーハサイズ：
12"/300mm
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
SEZ - LAM Davinci DV-34BF Backside Wet Etch System 300 mm構成
構成なしOEMモデルの説明
The DV-34BF is part of the Da Vinci Series, a single-wafer processing technology platform designed for high-volume manufacturing. It addresses new cleaning requirements for polymer removal and backside etch and clean, providing high-throughput and accurate wafer cleaning to maximize device yields. The four-chamber system performs a wide range of back-and frontside processes on 300 mm wafers and is optimized for emerging technologies such as high-k dielectrics, new metal gates, and non-volatile memory devices. It offers optimized process performance, high throughput, minimized footprint, advanced handling, reduced media consumption, flexible chemistry application, higher reliability, resulting in low CoO.ドキュメント
ドキュメントなし