説明
Single Wafer Processing構成
構成なしOEMモデルの説明
The SEZ 4300 is a 300mm single wafer processing system that combines SEZ’s process capability with high reliability and throughput. It uses a dual arm robot to transport wafers from four FOUPs to four process chambers, where two media (acid or solvent) can be used. The media can be recycled, heated, and filtered within the system or used in single pass mode. The system has an object-oriented software architecture with a Sematech compliant GUI and touch screen for easy operation. It offers a cost-effective throughput/footprint ratio and competitive CoO. Options like EPD and ozone processing are available to meet customer needs. Supported applications include etching for structuring, layer thinning, and layer stripping.ドキュメント
ドキュメントなし
LAM RESEARCH / SEZ
SP4300
検証済み
カテゴリ
Wet Etch
最終検証： 19日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
48208
ウェーハサイズ：
12"/300mm
ヴィンテージ：
2001
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
LAM RESEARCH / SEZ
SP4300
カテゴリ
Wet Etch
最終検証： 19日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
48208
ウェーハサイズ：
12"/300mm
ヴィンテージ：
2001
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Single Wafer Processing構成
構成なしOEMモデルの説明
The SEZ 4300 is a 300mm single wafer processing system that combines SEZ’s process capability with high reliability and throughput. It uses a dual arm robot to transport wafers from four FOUPs to four process chambers, where two media (acid or solvent) can be used. The media can be recycled, heated, and filtered within the system or used in single pass mode. The system has an object-oriented software architecture with a Sematech compliant GUI and touch screen for easy operation. It offers a cost-effective throughput/footprint ratio and competitive CoO. Options like EPD and ozone processing are available to meet customer needs. Supported applications include etching for structuring, layer thinning, and layer stripping.ドキュメント
ドキュメントなし