説明
説明なし構成
ETCH TOOLOEMモデルの説明
Equinox is a single wafer, multi-chamber process platform for cassette-to-cassette cleaning, etching, developing, and electroplating. It offers configurations from one to six chambers with a centralized controller and robotics. The platform is capable of performing various processes on substrates ranging from 3" to 200mm in size. It works by using a central dual end-effector robot to transfer substrates from cassette to chamber and back again. Equinox can help automate manual steps and transfers while increasing throughput with a small footprint. It offers ultra-clean dry-to-dry operation with uniform plating and etching results. The platform can integrate sequential process steps with a low cost of ownership (CoO) and provides a migration path from small R&D platforms to production systems with the same process chambers and control features.ドキュメント
ドキュメントなし
SEMITOOL
EQUINOX
検証済み
カテゴリ
Wet Processing / Wafer Cleaning
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
56536
ウェーハサイズ：
5"/125mm
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
SEMITOOL
EQUINOX
カテゴリ
Wet Processing / Wafer Cleaning
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
56536
ウェーハサイズ：
5"/125mm
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
説明なし構成
ETCH TOOLOEMモデルの説明
Equinox is a single wafer, multi-chamber process platform for cassette-to-cassette cleaning, etching, developing, and electroplating. It offers configurations from one to six chambers with a centralized controller and robotics. The platform is capable of performing various processes on substrates ranging from 3" to 200mm in size. It works by using a central dual end-effector robot to transfer substrates from cassette to chamber and back again. Equinox can help automate manual steps and transfers while increasing throughput with a small footprint. It offers ultra-clean dry-to-dry operation with uniform plating and etching results. The platform can integrate sequential process steps with a low cost of ownership (CoO) and provides a migration path from small R&D platforms to production systems with the same process chambers and control features.ドキュメント
ドキュメントなし