説明
説明なし構成
Config: 2f2d Chamber A Process : Wafer surface clean Chuck : Vacuum Chuck SPRAY : Soft Spray N2 10~100NL/min Rinse :DIW/ CO2 INJENCTION ,resistivity <1MΩ Spin DRY : 3000rpm Spin Dry only Chamber B Process : Wafer surface clean Chuck : Vacuum Chuck SPRAY : Soft Spray N2 10~100NL/min Rinse :DIW/ CO2 INJENCTION ,resistivity <1MΩ Spin DRY : 3000rpm Spin Dry only Chamber C Process : Wafer Backside clean Chuck : Mechanical Chuck SPRAY : Soft Spray N2 10~200NL/min Burush : PVA Burush Rinse :DIW/ CO2 INJENCTION ,resistivity <1MΩ Spin DRY : 2400rpm Spin Dry only Chamber D Process : Wafer Backside clean Chuck : Mechanical Chuck SPRAY : Soft Spray N2 10~200NL/min Burush : PVA Burush Rinse :DIW/ CO2 INJENCTION ,resistivity <1MΩ Spin DRY : 2400rpm Spin Dry only Software Version (include revision #) V242B000 System Power Rating 208AC 3-phase (eg. 110 AC 3-Phase for System) Loading Configuration 3 load ports (eg. 6 load positions for furnace or dual auto-indexer loaders) Process Modules Qty. 1 Loadport Qty 3 Power supply unit Qty 1 Vendor Chm Model Chemicals / Gases Used (not to use Micron Proprietary names) U03 SS(Surface) CO2Water U04 SS(Surface) CO2Water U05 SSR(Backside) CO2Water U06 SSR(Backside) CO2WaterOEMモデルの説明
Wafer Scrubberドキュメント
ドキュメントなし
SCREEN / DNS / DAINIPPON SCREEN
SS-3000-AR
検証済み
カテゴリ
Wet processing
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
47696
ウェーハサイズ：
12"/300mm
ヴィンテージ：
2005
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
SCREEN / DNS / DAINIPPON SCREEN
SS-3000-AR
検証済み
カテゴリ
Wet processing
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
47696
ウェーハサイズ：
12"/300mm
ヴィンテージ：
2005
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
説明なし構成
Config: 2f2d Chamber A Process : Wafer surface clean Chuck : Vacuum Chuck SPRAY : Soft Spray N2 10~100NL/min Rinse :DIW/ CO2 INJENCTION ,resistivity <1MΩ Spin DRY : 3000rpm Spin Dry only Chamber B Process : Wafer surface clean Chuck : Vacuum Chuck SPRAY : Soft Spray N2 10~100NL/min Rinse :DIW/ CO2 INJENCTION ,resistivity <1MΩ Spin DRY : 3000rpm Spin Dry only Chamber C Process : Wafer Backside clean Chuck : Mechanical Chuck SPRAY : Soft Spray N2 10~200NL/min Burush : PVA Burush Rinse :DIW/ CO2 INJENCTION ,resistivity <1MΩ Spin DRY : 2400rpm Spin Dry only Chamber D Process : Wafer Backside clean Chuck : Mechanical Chuck SPRAY : Soft Spray N2 10~200NL/min Burush : PVA Burush Rinse :DIW/ CO2 INJENCTION ,resistivity <1MΩ Spin DRY : 2400rpm Spin Dry only Software Version (include revision #) V242B000 System Power Rating 208AC 3-phase (eg. 110 AC 3-Phase for System) Loading Configuration 3 load ports (eg. 6 load positions for furnace or dual auto-indexer loaders) Process Modules Qty. 1 Loadport Qty 3 Power supply unit Qty 1 Vendor Chm Model Chemicals / Gases Used (not to use Micron Proprietary names) U03 SS(Surface) CO2Water U04 SS(Surface) CO2Water U05 SSR(Backside) CO2Water U06 SSR(Backside) CO2WaterOEMモデルの説明
Wafer Scrubberドキュメント
ドキュメントなし