説明
Batch Wafer Processing構成
構成なしOEMモデルの説明
The EXPEDIUS™ + is designed for 45nm and beyond technology node and has improved upon its predecessor in both performance and productivity. The configuration of the chemical treatment tanks, pure water rinse tanks, and dryer has been optimized to support FEOL clean, which requires particularly stringent process performance. Standard installation of the new SD2 dryer enables significant reduction of 45nm size or less micro-particles. The new SD2 which has been improved from TEL's original IPA dry module decreases the surface tension and prevents pattern destruction of vulnerable structures on the wafer. Furthermore the EXPEDIUS™ + provides high throughput and excellent productivity through a new wafer transportation system with smaller footprint. In addition, its unique batch-formation software option enhances process efficiency regardless of wafer quantity and processing position.ドキュメント
ドキュメントなし
TEL / TOKYO ELECTRON
EXPEDIUS +
検証済み
カテゴリ
Wet processing
最終検証： 8日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
91750
ウェーハサイズ：
不明
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
TEL / TOKYO ELECTRON
EXPEDIUS +
カテゴリ
Wet processing
最終検証： 8日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
91750
ウェーハサイズ：
不明
ヴィンテージ：
不明
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Batch Wafer Processing構成
構成なしOEMモデルの説明
The EXPEDIUS™ + is designed for 45nm and beyond technology node and has improved upon its predecessor in both performance and productivity. The configuration of the chemical treatment tanks, pure water rinse tanks, and dryer has been optimized to support FEOL clean, which requires particularly stringent process performance. Standard installation of the new SD2 dryer enables significant reduction of 45nm size or less micro-particles. The new SD2 which has been improved from TEL's original IPA dry module decreases the surface tension and prevents pattern destruction of vulnerable structures on the wafer. Furthermore the EXPEDIUS™ + provides high throughput and excellent productivity through a new wafer transportation system with smaller footprint. In addition, its unique batch-formation software option enhances process efficiency regardless of wafer quantity and processing position.ドキュメント
ドキュメントなし