説明
WET構成
1MF+6CH(4*POU(APM/HF/NH4OH/HPM), 2*SD2)OEMモデルの説明
The EXPEDIUS™ -i is the latest auto wet station succeeding from the EXPEDIUS™ +, a platform featuring further improvements in process performance and productivity. The system has a highly cost effective solution designed for 45nm and beyond technology node for semiconductor manufacturing. The EXPEDIUS™ -i achieved a throughput of 1,000 wafers per hour (a 150% increase compared with the previous model), high productivity, and low Cost of Ownership. Implementation of the chemical treatment and pure water rinse tanks, well-optimized dryer module improves its cleaning and resist stripping performance significantly. The system realized greatly improvement both etch shape control and process stability for the selective etch process. Furthermore, in order to suppress pattern collapse of vulnerable structures, advanced dryer contributes to reduce processing time drastically and collaborate with optimum sequencing, the system achieved shortened throughput times and the highest level of cost performance in the industry.ドキュメント
ドキュメントなし
TEL / TOKYO ELECTRON
EXPEDIUS-i
検証済み
カテゴリ
Wet processing
主なアイテムの詳細
状態:
Used
稼働ステータス:
不明
製品ID:
93652
ウェーハサイズ:
不明
ヴィンテージ:
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示TEL / TOKYO ELECTRON
EXPEDIUS-i
検証済み
カテゴリ
Wet processing
最終検証: 30日以上前
主なアイテムの詳細
状態:
Used
稼働ステータス:
不明
製品ID:
93652
ウェーハサイズ:
不明
ヴィンテージ:
不明
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
WET構成
1MF+6CH(4*POU(APM/HF/NH4OH/HPM), 2*SD2)OEMモデルの説明
The EXPEDIUS™ -i is the latest auto wet station succeeding from the EXPEDIUS™ +, a platform featuring further improvements in process performance and productivity. The system has a highly cost effective solution designed for 45nm and beyond technology node for semiconductor manufacturing. The EXPEDIUS™ -i achieved a throughput of 1,000 wafers per hour (a 150% increase compared with the previous model), high productivity, and low Cost of Ownership. Implementation of the chemical treatment and pure water rinse tanks, well-optimized dryer module improves its cleaning and resist stripping performance significantly. The system realized greatly improvement both etch shape control and process stability for the selective etch process. Furthermore, in order to suppress pattern collapse of vulnerable structures, advanced dryer contributes to reduce processing time drastically and collaborate with optimum sequencing, the system achieved shortened throughput times and the highest level of cost performance in the industry.ドキュメント
ドキュメントなし