説明
Wedge Bond構成
構成なしOEMモデルの説明
Introducing the Bondjet BJ820: High-Speed Fully Automatic Fine Wire Wedge Bonder. It excels in wire bonding for diverse applications like RF devices, COB, MCM, automotive, etc., with aluminum, gold, or ribbon wire. Unmatched speed, precision, and flexibility make it an industry benchmark. Real-time bond quality monitoring, intelligent automation, and optimized tool change further enhance its capabilities. Up to 7 wires/sec, 1 μm at 3 σ axis repeatability, and a large 305mm x 410mm bonding area. Offers loop length adjustment from 70 µm up to 20 mm.ドキュメント
ドキュメントなし
HESSE & KNIPPS
BONDJET 820
検証済み
カテゴリ
Wire / Wedge / Ball Bonder
最終検証： 30日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
115802
ウェーハサイズ：
不明
ヴィンテージ：
2011
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
HESSE & KNIPPS
BONDJET 820
カテゴリ
Wire / Wedge / Ball Bonder
最終検証： 30日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
115802
ウェーハサイズ：
不明
ヴィンテージ：
2011
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Wedge Bond構成
構成なしOEMモデルの説明
Introducing the Bondjet BJ820: High-Speed Fully Automatic Fine Wire Wedge Bonder. It excels in wire bonding for diverse applications like RF devices, COB, MCM, automotive, etc., with aluminum, gold, or ribbon wire. Unmatched speed, precision, and flexibility make it an industry benchmark. Real-time bond quality monitoring, intelligent automation, and optimized tool change further enhance its capabilities. Up to 7 wires/sec, 1 μm at 3 σ axis repeatability, and a large 305mm x 410mm bonding area. Offers loop length adjustment from 70 µm up to 20 mm.ドキュメント
ドキュメントなし