説明
説明なし構成
HBK 07 Bondhead (backcut) with active knife, 60 kHz transducer Ribbon size: 0.075 x 0.75 mm to 0.3 x 2 mm Wire diameter range: 100 µm to 500 µm Working area 350mm x 500mm (13.8" x 19.7") Bondheads for thick wire and ribbon applications Repeatability of the axes: 2 μm at 3 Sigma Wire spool, 4", motor driven Wire control and wire consumption measurement Active cutting system 4-Axis (X, Y, Z Theta) (3) Linear motors (2) Brushless servomotors Mini CCD camera with optics unit TFT Monitor High-res automatic image processing system 32-Bit digital I/O interface, electrically isolated, 24 V Keyboard and trackball Quality controller Microscope Enclosure incl. security system Bonding process: Aluminum Gold Copper wire Consumables: (4) Wedge tools for 200μm wires (50) Wire guides (9) Backcuts Power supply: 230 V, 50/60 HzOEMモデルの説明
Introducing Bondjet BJ939: Fully Automatic Heavy Wire Bonders by Hesse GmbH, equipped with unique features. Non-destructive pull test & transducer sensor ensure real-time quality monitoring. High speed, largest bonding area, and advanced programmable features enhance productivity. Up to 3 wires/s, 2 μm at 3 σ repeatability, and integrated quality control for precise results.ドキュメント
ドキュメントなし
カテゴリ
Wire / Wedge / Ball Bonder
最終検証： 14日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
145514
ウェーハサイズ：
不明
ヴィンテージ：
2014
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
HESSE & KNIPPS
BONDJET 939
カテゴリ
Wire / Wedge / Ball Bonder
最終検証： 14日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
145514
ウェーハサイズ：
不明
ヴィンテージ：
2014
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
説明なし構成
HBK 07 Bondhead (backcut) with active knife, 60 kHz transducer Ribbon size: 0.075 x 0.75 mm to 0.3 x 2 mm Wire diameter range: 100 µm to 500 µm Working area 350mm x 500mm (13.8" x 19.7") Bondheads for thick wire and ribbon applications Repeatability of the axes: 2 μm at 3 Sigma Wire spool, 4", motor driven Wire control and wire consumption measurement Active cutting system 4-Axis (X, Y, Z Theta) (3) Linear motors (2) Brushless servomotors Mini CCD camera with optics unit TFT Monitor High-res automatic image processing system 32-Bit digital I/O interface, electrically isolated, 24 V Keyboard and trackball Quality controller Microscope Enclosure incl. security system Bonding process: Aluminum Gold Copper wire Consumables: (4) Wedge tools for 200μm wires (50) Wire guides (9) Backcuts Power supply: 230 V, 50/60 HzOEMモデルの説明
Introducing Bondjet BJ939: Fully Automatic Heavy Wire Bonders by Hesse GmbH, equipped with unique features. Non-destructive pull test & transducer sensor ensure real-time quality monitoring. High speed, largest bonding area, and advanced programmable features enhance productivity. Up to 3 wires/s, 2 μm at 3 σ repeatability, and integrated quality control for precise results.ドキュメント
ドキュメントなし