説明
説明なし構成
構成なしOEMモデルの説明
"""High productivity bonder for low-to-medium pin count applications."" ConnX Plus is a second generation ball bonder under the successful Power SeriesTM. When compared to the previous generation, the ConnX Plus further increases net productivity in low pin count, discrete and cost performance markets.In addition to features of the prior generation ConnXPSTM wire bonder, the ConnX Plus includes exciting new enhancements to help further increase efficiency and net productivity: Interactive Programmable Look Ahead Vision to ease first time set-up Power Series Xpress Loop to help increase the productivity of short wire applications Allows the integration of the optional Dual Mag Optics Kit to support stacked die applications in discrete and low pin count devices Field upgradable to the ConnX Plus LAPSTM in order to support an 87mm bondable area 10% higher UPH (Units Per Hour) over the first generation ConnX ball bonder.""" Wire Bonderドキュメント
ドキュメントなし
カテゴリ
Wire / Wedge / Ball Bonder
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
120151
ウェーハサイズ：
不明
ヴィンテージ：
2015
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
KULICKE & SOFFA (K&S)
ConnX PLUS
カテゴリ
Wire / Wedge / Ball Bonder
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
120151
ウェーハサイズ：
不明
ヴィンテージ：
2015
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
説明なし構成
構成なしOEMモデルの説明
"""High productivity bonder for low-to-medium pin count applications."" ConnX Plus is a second generation ball bonder under the successful Power SeriesTM. When compared to the previous generation, the ConnX Plus further increases net productivity in low pin count, discrete and cost performance markets.In addition to features of the prior generation ConnXPSTM wire bonder, the ConnX Plus includes exciting new enhancements to help further increase efficiency and net productivity: Interactive Programmable Look Ahead Vision to ease first time set-up Power Series Xpress Loop to help increase the productivity of short wire applications Allows the integration of the optional Dual Mag Optics Kit to support stacked die applications in discrete and low pin count devices Field upgradable to the ConnX Plus LAPSTM in order to support an 87mm bondable area 10% higher UPH (Units Per Hour) over the first generation ConnX ball bonder.""" Wire Bonderドキュメント
ドキュメントなし