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KULICKE & SOFFA (K&S) Maxµm Plus
  • KULICKE & SOFFA (K&S) Maxµm Plus
  • KULICKE & SOFFA (K&S) Maxµm Plus
  • KULICKE & SOFFA (K&S) Maxµm Plus
説明
Wire Bonding Machine
構成
構成なし
OEMモデルの説明
The industry-leading performance of the award-winning Maxµm™ high speed ball bonder is taken to an even higher level with the introduction of the new Maxµmplus. Users who want greater throughput and finer pitch capability can expect: UPH 10% greater than the Maxµm on most applications + 2.5 µm accuracy at 3 sigma 35 µm ultra-fine-pitch process capability This yield-enhancing accessory consists of the following... Innovative Moving EFO Wand Technology Electronic Flame-Off from directly below the wire axis Specially designed, Fine-tipped EFO Wand and 8X Mag Optics ...resulting in these benefits: Improved Free Air Ball and Bonded Ball Concentricity Reduced "Small Ball" occurrence Better intermetalic coverage and higher bond strength Greater yield for ultra-fine-pitch processes A reduced-friction wire feed path for wire down to 15 µm diameter and more efficient X-Y table motion help reduce wire cycle times to 63.0 msec. Advanced teaching and calibration software improve overall accuracy to ± 2.5 µm. This combination allows ultra-fine-pitch bonding of devices at speeds that are as much as 10% faster than the Maxµm — already the industry benchmark for accuracy and throughput.
ドキュメント

ドキュメントなし

カテゴリ
Wire / Wedge / Ball Bonder

最終検証: 60日以上前

主なアイテムの詳細

状態:

Used


稼働ステータス:

Installed / Idle


製品ID:

121077


ウェーハサイズ:

不明


ヴィンテージ:

2005


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示

KULICKE & SOFFA (K&S)

Maxµm Plus

verified-listing-icon
検証済み
カテゴリ
Wire / Wedge / Ball Bonder
最終検証: 60日以上前
listing-photo-30d474cde13e4b9ab3c7f953ab5f44cd-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
主なアイテムの詳細

状態:

Used


稼働ステータス:

Installed / Idle


製品ID:

121077


ウェーハサイズ:

不明


ヴィンテージ:

2005


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Wire Bonding Machine
構成
構成なし
OEMモデルの説明
The industry-leading performance of the award-winning Maxµm™ high speed ball bonder is taken to an even higher level with the introduction of the new Maxµmplus. Users who want greater throughput and finer pitch capability can expect: UPH 10% greater than the Maxµm on most applications + 2.5 µm accuracy at 3 sigma 35 µm ultra-fine-pitch process capability This yield-enhancing accessory consists of the following... Innovative Moving EFO Wand Technology Electronic Flame-Off from directly below the wire axis Specially designed, Fine-tipped EFO Wand and 8X Mag Optics ...resulting in these benefits: Improved Free Air Ball and Bonded Ball Concentricity Reduced "Small Ball" occurrence Better intermetalic coverage and higher bond strength Greater yield for ultra-fine-pitch processes A reduced-friction wire feed path for wire down to 15 µm diameter and more efficient X-Y table motion help reduce wire cycle times to 63.0 msec. Advanced teaching and calibration software improve overall accuracy to ± 2.5 µm. This combination allows ultra-fine-pitch bonding of devices at speeds that are as much as 10% faster than the Maxµm — already the industry benchmark for accuracy and throughput.
ドキュメント

ドキュメントなし

同様のリスト
すべて表示