説明
SPECIFICATIONS MICROPROCESSOR: TI 990,16 Bit MEMORY: Battery Backup Ram. DISPLAY: LCD: 40 Character, 3-line, English / Foreign languages. DATA ENTRY: Digital Switch,0-999. DEVICE STORAGE BUFFERS: 30 MANIPULATOR: Single-lever X-Y-Z, 8:1 Ratio. THROAT DEPTH: 6 inches. WORKING ENVELOPE: 12 inches square x 2.687 inches high. WORK HEIGHT ADJUSTMENT: 0.625 inches. WORK PLATFORM: With 6 inch rotary, or without (choice). WORK HOLDERS: Heated or unheated, interchangeable FEATURES MICROPROCESSOR-CONTROLLED machine variables with dynamic LCD status indicators. ALL PRE-SET VALUES tracked and displayed with memory for three device types. 12 INCH WORKING ENVELOPE for large modules or MCMS. FAULT DIAGNOSTICS. HEATED and UNHEATED workholders, custom made. PROGRAMMABLE LOOP and PROGRAMMABLE STITCH PROGRAMMABLE TAIL/PULL STROKE. LOAD CELL feedback of bond force values displayed in real time ENCODED Z AXIS with positional feedback. 8 BIT CONTROL of ultrasonic power and time over any bond. DETATCHABLE WORK PLATFORM with single-knob, pure vertical height adjustment (5/8″). FEATHER-LIGHT and COUNTERBALANCED X-Y-Z mechanism 90 DEGREE DEEP-ACCESS TOOL ASSEMBLY convertible wit 45 degree tool assembly.構成
構成なしOEMモデルの説明
Wire Bonderドキュメント
ドキュメントなし
WESTBOND
7400B
カテゴリ
Wire / Wedge / Ball Bonder
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
125445
ウェーハサイズ：
不明
ヴィンテージ：
不明
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
SPECIFICATIONS MICROPROCESSOR: TI 990,16 Bit MEMORY: Battery Backup Ram. DISPLAY: LCD: 40 Character, 3-line, English / Foreign languages. DATA ENTRY: Digital Switch,0-999. DEVICE STORAGE BUFFERS: 30 MANIPULATOR: Single-lever X-Y-Z, 8:1 Ratio. THROAT DEPTH: 6 inches. WORKING ENVELOPE: 12 inches square x 2.687 inches high. WORK HEIGHT ADJUSTMENT: 0.625 inches. WORK PLATFORM: With 6 inch rotary, or without (choice). WORK HOLDERS: Heated or unheated, interchangeable FEATURES MICROPROCESSOR-CONTROLLED machine variables with dynamic LCD status indicators. ALL PRE-SET VALUES tracked and displayed with memory for three device types. 12 INCH WORKING ENVELOPE for large modules or MCMS. FAULT DIAGNOSTICS. HEATED and UNHEATED workholders, custom made. PROGRAMMABLE LOOP and PROGRAMMABLE STITCH PROGRAMMABLE TAIL/PULL STROKE. LOAD CELL feedback of bond force values displayed in real time ENCODED Z AXIS with positional feedback. 8 BIT CONTROL of ultrasonic power and time over any bond. DETATCHABLE WORK PLATFORM with single-knob, pure vertical height adjustment (5/8″). FEATHER-LIGHT and COUNTERBALANCED X-Y-Z mechanism 90 DEGREE DEEP-ACCESS TOOL ASSEMBLY convertible wit 45 degree tool assembly.構成
構成なしOEMモデルの説明
Wire Bonderドキュメント
ドキュメントなし