説明
説明なし構成
-AXIS Active Image Stabilisation -XiDAT 2.0 imaging chain -Up to 70 degree oblique angle views over the entire inspection area -Enhanced automated inspection routines -Automatic BGA and die-void measurements -Comprehensive data logging and reporting facilities -Uninterrupted rotating live oblique views 360 degrees around any point in the sampleOEMモデルの説明
The Dage XD7600NT is an X-ray inspection system that provides oblique angle viewing of up to 70-degrees for any position 360-degrees around any point of the entire 18” x 16” (458 x 407 mm) inspection area allowing the XD7600NT to inspect all interconnections and PCBs containing BGA and CSP devices. It has a standard 2.0 mega pixel imaging system and can be equipped with a computerized tomography (CT) option providing 3D modeling and volumetric measurement of solder joints.ドキュメント
ドキュメントなし
NORDSON / DAGE
XD7600NT
検証済み
カテゴリ
X-Ray / XRD / XRF
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
114028
ウェーハサイズ：
不明
ヴィンテージ：
2009
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
NORDSON / DAGE
XD7600NT
カテゴリ
X-Ray / XRD / XRF
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
114028
ウェーハサイズ：
不明
ヴィンテージ：
2009
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
説明なし構成
-AXIS Active Image Stabilisation -XiDAT 2.0 imaging chain -Up to 70 degree oblique angle views over the entire inspection area -Enhanced automated inspection routines -Automatic BGA and die-void measurements -Comprehensive data logging and reporting facilities -Uninterrupted rotating live oblique views 360 degrees around any point in the sampleOEMモデルの説明
The Dage XD7600NT is an X-ray inspection system that provides oblique angle viewing of up to 70-degrees for any position 360-degrees around any point of the entire 18” x 16” (458 x 407 mm) inspection area allowing the XD7600NT to inspect all interconnections and PCBs containing BGA and CSP devices. It has a standard 2.0 mega pixel imaging system and can be equipped with a computerized tomography (CT) option providing 3D modeling and volumetric measurement of solder joints.ドキュメント
ドキュメントなし