説明
X-Ray Metrology構成
D8 FABLINE MH with TXS 1 High Brightness (2KW) Bruker Rotating Anode HB-TXS Spartan EFEM dual load port for 300mm wafers 2 Brooks Automation Automation software PTO from Peer Group 1 UMC 300 wafer stage with short tracks on primary side 1 Primary optics for micro diffraction, TXS X-ray system 1 LynxEye detector for secondary side + mount 1 Waferchuck 1 Pattern recognition software 1 Keyence laser triangulation module for fast height alignment 1 c.OEMモデルの説明
The D8 FABLINE provides fully automated handling of 300mm wafers . It provides a wide spectrum of techniques, such as rapid X-ray reflectivity (XRR), grazing incidence X-ray diffraction (GID), and high-resolution X-ray diffraction (HR-XRD) in order to facilitate advanced process development and control on strained devices and high-K thin films, as well as materials characterization for future generation technology nodes.ドキュメント
ドキュメントなし
BRUKER
D8 FABLINE
検証済み
カテゴリ
X-Ray
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
95109
ウェーハサイズ：
12"/300mm
ヴィンテージ：
2015
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
BRUKER
D8 FABLINE
検証済み
カテゴリ
X-Ray
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
95109
ウェーハサイズ：
12"/300mm
ヴィンテージ：
2015
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
X-Ray Metrology構成
D8 FABLINE MH with TXS 1 High Brightness (2KW) Bruker Rotating Anode HB-TXS Spartan EFEM dual load port for 300mm wafers 2 Brooks Automation Automation software PTO from Peer Group 1 UMC 300 wafer stage with short tracks on primary side 1 Primary optics for micro diffraction, TXS X-ray system 1 LynxEye detector for secondary side + mount 1 Waferchuck 1 Pattern recognition software 1 Keyence laser triangulation module for fast height alignment 1 c.OEMモデルの説明
The D8 FABLINE provides fully automated handling of 300mm wafers . It provides a wide spectrum of techniques, such as rapid X-ray reflectivity (XRR), grazing incidence X-ray diffraction (GID), and high-resolution X-ray diffraction (HR-XRD) in order to facilitate advanced process development and control on strained devices and high-K thin films, as well as materials characterization for future generation technology nodes.ドキュメント
ドキュメントなし