ACCRETECH next generation systems support optimum device productions.

The UF3000 is a fully automatic, ultra-high function probing machine developed by ACCRETECH / TSK to be the de facto standard model for the semiconductor testing process. It meets a wide range of customer requirements, including high-mix low-volume production for System LSI and mass production for memories. The machine has received high evaluation from major device manufacturers in terms of CoO (Cost of Ownership) and OEE (Overall Equipment Efficiency).

ACCRETECH / TSK

UF3000

The Accretech UF200 Wafer probing machine is a highly advanced tool with a capacity of 2000 pins. It utilizes Moire scale in the AC servo motor closed-loop control system to achieve fast and precise positioning, boasting a stage accuracy of 2 µm. This machine represents a significant advancement in wafer probing technology, offering users efficient and accurate performance for their probing needs.

UF200

The ACCRETECH / TSK UF200A is a probing machine used for wafer and CSP handling. It is a highly efficient, high throughput machine that offers better cost performance. It can perform transfer and testing on 5 to 8 inch wafers and has a variety of options for all kinds of wafer tests.

UF200A

The Accretech UF3000EX is a fully automatic wafer prober for the highest production requirements. It is now even quicker and more precise, with an extremely high throughput and highest probe power. It also has an optical measurement system and very precise navigation.

UF3000EX

The A-WD-200T is the first twin-spindle dicer for 200mm wafers. The A-WD-200T is a wafer dicing machine that features a face-to-face, twin-spindle arrangement and X-axis acceleration for outstanding throughput. The machine is equipped with a linear motor in the X-axis mechanism that enhances dicing quality by minimizing vibration. The color LCD touch-panel operation screen is easy to understand and convenient to use. Additionally, the X-axis drive mechanism is now entirely contact- and maintenance-free, making it a reliable and efficient choice for wafer dicing operations.

A-WD-200T

The A-PM-90A Series is an 8-inch full-auto machine designed for high precision and high rigidity. It is specifically designed for memory and logic devices, which are becoming increasingly miniaturized and multi-pin. The machine features an automatic needle matching function, among other features, making it ideal for unmanned line construction. Additionally, the A-PM-90A Series boasts high throughput and cleanliness handling, ensuring efficient and reliable operation. 

A-PM-90A

ACCRETECH / TSK UF 200SA is a Probers system. The UF 200SA can produce wafer size of 8".

UF200SA

The UF3000EX-e is a fully automatic wafer prober that is also available for numerous special applications. It is uncompromising for throughput, very flexible for application, and has very precise navigation. It uses non-contact measurement and can handle wafers from 200 to 300 mm in diameter, including special types of wafers. The UF3000EX-e features a newly developed XY stage drive unit and a new algorithm for extremely high throughput, an improved Z-platform for the highest probe power, and a 15-inch LCD touch screen for easy operation. It also has an Optical Target Scope (OTS) for very precise measurements of the relative positions of probe cards and chucks, a tri-color 3-level magnifying function for color recording and 3 enhancement levels, and a navigation display function that allows the user to manage each desired wafer point by simply touching the wafer map.

UF3000EX-e

High-precision XYZ control system with minimum footprint and high throughput, Multiple operation mode(manual, semi-auto, lull-auto} 

UF60

The ACCRETECH / TSK UF3000LX is a probing machine that performs electrical tests of each chip on a wafer, ensuring the quality of semiconductor devices. It is a prober with high-speed probing that targets non-memory devices. High-speed and low-vibration are achieved by adopting the newly developed exclusive XY driving system. Compared with existing products, it has a smaller footprint due to design changes and has reduced power consumption by 10% in consideration for the environment.

UF3000LX

Wafer Dicing Machine - The full automatic wafer dicing machine with the face-to-face twin-spindles, ready for the 300 mm wafer.

A-WD 300T

The ACCRETECH / TSK UF2000 is a probing machine for 200mm wafers. It is a high precision, high rigidity machine that offers a variety of options for wafer test. Some of the options include testing environments that can adopt from ultrahigh to low temperature, transfer of warpage and ultrathin wafer by the special transfer mechanism, and a low noise testing environment.

UF2000

Wafer probers are used in the semiconductor industry to test and measure electrical characteristics of integrated circuits (ICs) on wafers before they are packaged. The UF190B is typically used in research and development, quality control, and production testing of ICs.

UF190B

DH-150	

ACCRETECH / TSK UF200S is a probing machine used for electrical testing of each chip on a wafer, ensuring the quality of semiconductor devices.

UF200S

A-PM-60B

MHF300L

A-WD-300TX

This prober is specially designed for general logic devices, not only inherits the basic concept of UF200, but also further adopts the latest architecture. It can perform transfer and probe testing of 5 to 8 inch wafers. Use the same MMI as the UF2000. Multiple options to achieve all non-industry standard types of wafer probes.

UF200R

Optimized spacing by utilizing all components and optional unit well within the compartment
Standard Spindles up to 60,000 rpm
(80,000 rpm as optional)
Enhanced throughput
①X axis 1,000 mm/sec, Y axis 300 mm/sec, and Z axis 80 mm/sec
②Two Optical Cutter-Set units
③The Worlds’ smallest blade-to-blade distance
17” LCD touch panel and new GUI
GUI（Graphical User Interface)　with simple layout and large touch-buttons allow users’ interactive operation
Easy and simple Kerf check function
(AI kerf check function)
Over 10,000 recipes storable
USB port as standard
(USB memory device can be used as external memory)
Ease-of-maintenance
Wide maintenance door and front-side accessibility allows easy of routine maintenance
Optimized vacuum controller
Reduces 50% of air consumption compared with existing model

AD3000T

The A-WD-5000A is a high-speed, high-precision machine that boasts the world’s smallest size. It features a database of optimum machining conditions, a multi-function design that considers expandability, and an energy-saving design. This machine is designed to provide the best possible performance while minimizing its environmental impact.

A-WD-5000A	

Stand-alone wafer cleaning unit, A-CS-1OOA will provide best solution for cleaning and drying the wafer such as sawn with semi-automatic dicing saws. High-pressure water spray up to 10 MPa driven by horizontal swinging arm will achieve excellent cleaning quality.
■ Maximum rotation speed of spinning table is up to 3,000 min-1
■ Available frame size: 5 to 8"
■ Cleaning method: High-pressure
Rinse Air dry (Driven by swing arm)

A-CS-100A

 UF300 is a state-of-the-art device that is ready for volume production of 300 mm lines. It is capable of producing large quantities of 300 mm lines, making it an ideal choice for high-volume manufacturing operations.

UF300

UF190R

The ACCRETECH / TSK UF200AL is a probing machine for 200mm wafers. It is a high precision, high rigidity machine that offers improved precision and throughput. It also has a variety of options for all kinds of wafer tests that are not standard in the industry.

UF200AL

A-WD-100A

WIN WIN 50

WIN-WIN 50-1600

U-FW-300B

AP3000e

MHF300S	

A-WD-100M

The A-WD-10A is a compact wafer dicing machine capable of dicing wafers up to 160 mm square in size. It features a smooth grinding feed and a high reliability power spindle, making it a reliable and efficient choice for your wafer dicing needs.

A-WD-10A

The FP2000 is a probing machine made by ACCRETECH / TSK. It performs precision measurements using their unique correction technology on cut wafers, packages and such that are attached to the dicing frame. It is a multi-functional prober that performs transfer and testing on a frame as well as wafers of 5 to 8 inches with only one click of a button.

FP2000

AD20S

UF3000EX-f

The FP3000 is a probing machine manufactured by ACCRETECH. It is a 300mm framed wafer & CSP handling machine that performs precision measurement using their unique correction technology on cut wafer, package and such that are attached to the dicing frame. It is a multi-functional prober that performs transfer and testing on a frame as well as wafer with only one click of button by optional function.

FP3000

Grinder + CMP stress release High through put wafer handling 15umt wafer thickness in mass producing. The RM200/300 offers a single-unit solution supplementing PG200/300 processing with additional functionality to remove protective tape from thinner wafers and apply wafers to dicing frames. Performs the processes of the rough grinding, fine grinding, polishing and cleaning wafers on the both sides in a single machine. All the processes are completed without moving the wafer on the same chuck table.

PG300RM

ML200Plus

The AD2000T is a fully automatic dicing machine for 200mm wafers made by ACCRETECH / TSK. It is the smallest dicing machine in the world and has the highest space efficiency. It also has a low cost of ownership and a high processing speed, with the X-axis up to 1,000 mm/sec and the Y-axis up to 300 mm/sec. The AD2000T has several features, including a refined Graphic User Interface with a Help function and an easy and simple Kerf check function. It also has a standard spindle up to 60,000 rpm, with an optional high-speed spindle up to 80,000 rpm. The machine is designed for easy maintenance, with a wide maintenance door and front-side accessibility.

AD2000T

TIGER/WW50 1600

MHF6000

MHF400R

MHF600

HRG200X

AD20T

MHF4000

A-WD-250S

Most significant machine model for 200mm wafers High precision, high rigidity machine.

UF200SFL

MHF410

PG200RM

UF200FL is a Probers Machine that is equipped with a temperature control unit and two auto needles for height alignment and position alignment. It also comes equipped with its self needle cleaning units, profile sensors.

UF200FL

Surface texture measuring instrument. Superior GUI achieve easy operability.
Flexible editing of analysis results.

SURFCOM 1400D

The Wafer Probing Machine UF300A is a highly advanced equipment designed for wafer probing processes. It offers precise stage-positioning capabilities with an accuracy of 2 micro-meters and is compatible with wafers of ø 300 mm in size. The machine features a Z-theta stage that provides super-high rigidity, ensuring stability during probing operations.

UF300A

The ACCRETECH / TSK UF 200H is a Prober system. The TSK UF 200H can be used with 5”-8” wafer sizes. It has XY Position accuracy and pin to pad alignment. This system has fail mark inspection, needle alignment, and auto needle height setting.

UF200H

UF200SA/FL

8” Separator for stealth laser diced 8” wafer

SEP200B

SS10 

SS20

A-PM-90V

A-WD-10B

MHF4000S

A-PM-90A-N

12” Separator for stealth laser diced 12” wafer

SEP300

Stand-alone wafer cleaning unit, A-CS-300 provides best solution for cleaning and drying the wafer cut by semi-automatic dicing saws. Air accelerated water nozzle and horizontal swing arm achieves excellent cleaning quality.

A-CS-300

PS280

PG3000RMX2

AP3000

SCU-500S

AD3000T-PLUS 

A-WD-208T

MHF9000EX

ML300Plus-WH

The Surfcom 3000A (manufactured by Tokyo Seimitsu / Accretech and distributed/partnered with Zeiss) is a high-precision surface roughness and contour profile measuring instrument.

SURFCOM 3000A

PG3000RM

A-PM-90AF

ACCRETECH / TSK FP200 Probers are a type of probing machines that perform electrical tests of each chip on a wafer, ensuring the quality of semiconductor devices. They can handle both framed wafers and CSPs (chip scale packages) with high precision and speed. They can also test wafers of 5 to 8 inches with only one click of button.

FP200

UF190 is a high-speed product that offers a high cost-performance ratio. This means that it provides excellent performance and speed at a reasonable cost, making it a great value for its price.

UF190

The ACCRETECH / TSK UF200A/AL is a wafer prober1. It is the most significant machine model for 200mm wafers and is known for its high precision and high rigidity.

UF200A/AL

ML300EX

ML300Plus-FHWH

The UF200D is a machine that features parallel processing with dual-stages. This allows for efficient and simultaneous processing of multiple tasks, resulting in increased productivity and faster completion times. 

UF200D

AD3000T-HC PLUS

MHF4000L

MHF4000EX

ChaMP211

A-PM-88A

ML300

Compatible with 200 / 150 / 100 mm size wafer.

ChaMP 232

PS300

ML300Plus-FH

ML300PlusX-FHWH

HRG300A

ChaMP 332

PG300

SURFCOM 590A-64

SS30

The A-WD-300 is a wafer dicing machine that is the world’s smallest 300 mm fully-automatic wafer dicing machine. It has substantially improved throughput with the installation of the twin-spindle and boasts a total accuracy of 4 µm. With its compact size and high precision, the A-WD-300 is a powerful tool for wafer dicing.

A-WD-300

The W-SL-300 is a Wire Saw Slicing Machine that is designed for high-throughput slicing of plural wafers at a time. It is capable of slicing large-diameter ingots up to 300 mm, providing high-precision and high-processing quality while maintaining high-productivity. Additionally, the W-SL-300 is an economical machine with a small footprint and low running costs, making it an ideal choice for businesses looking to maximize their efficiency and productivity.

W-SL-300

The FP200A is a probing machine made by ACCRETECH / TSK. It performs precision measurement using their unique correction technology on cut wafer, package and such that are attached to the dicing frame. It is a multi-functional prober which performs transfer and testing on a frame as well as wafer of 5 to 8 inches with only one click of button. Some of the features of the FP200A probing machine include: It performs precision measurement using ACCRETECH’s unique correction technology on cut wafer, package and such that are attached to the dicing frame. It is a multi-functional prober which performs transfer and testing on a frame as well as wafer of 5 to 8 inches with only one click of button. Optimization of correction value is realized by the application software which is the outcome of the well-accumulated experiences of 15 years since the release of the frame transfer prober.

ACCRETECH / TSK

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