The SEMILAB FAAST 230 is a non-contact, fast in-line monitoring system designed to detect heavy metal contamination, including sub 108 atoms/cm-3 Fe detection, in a medium to high-volume manufacturing environment. It features automated wafer handling, with options for SMIF/FOUP Loadport/Versaport, and can perform full wafer FAST mapping of diffusion length, Iron, and other recombination centers. The system is configurable for 100 mm to 300 mm wafers and is compatible with other Semilab SDI FAaST tool measurement technologies. Additional options include a minienvironment, wafer edge-grip handling, wafer flipper for automatic backsurface measurement, and more. 

SEMILAB

FAAST 230

WT-2000D

WT-2000 PVN

The FAaST 300 SL system is a non-contact electrical metrology system that combines both Micro and Macro corona-Kelvin methods into a single platform. It is designed to support advanced R&D as well as high-volume manufacturing environments. The system features automatic robotic wafer handling, dual FOUP Loadport, and is suitable for patterned wafer and monitor wafer measurements. It uses Semilab SDI’s patented high-resolution Micro corona-Kelvin based on Kelvin Probe Force Microscopy (KPFM) for measurement of dielectric and interface properties. The system also includes an advanced 2-step Non-Visual Defect (NVD) Inspection that combines full wafer Macro surface voltage imaging and focused high-resolution intra-die surface voltage imaging using KPFM. The FAaST software package includes Measurement, Recipe Writing, and Data Viewing applications. The system is suitable for measurement on semiconductors with high-k and low-k dielectric films, and is available in a default configuration for 300mm wafers or with an option for 200mm/300mm bridge configuration. Additional options include a Mini-environment, 300mm Semi compliant Automation, Seismic brackets, wafer OCR, RFID, cassette barcode reader, and a 1000V Vcpd measurement range.

FAAST 300 SL

The Semilab WT-2000PVN is a compact measurement system that can perform a range of measurements on photovoltaic (PV) cells, wafers, and blocks. The system comes with overhead functions and can be customized to meet your specific measurement needs by choosing from the available options. The WT-2000PVN is capable of measuring both blocks and ingots, as well as wafers and cells. When measuring wafers and cells, maps are typically produced, while line scans are often used for blocks or ingots to save time. However, the WT-2000PVN can do both. Many PV cell manufacturers use the WT-2000PVN for engineering development, characterization, production batch testing, and troubleshooting production issues. The system can be integrated with various measurement techniques, including µ-PCD/carrier lifetime, SHR/sheet resistance, LBIC/photovoltaic response, quantum efficiency, diffusion length, and eddy current/non-contact resistivity mapping.

WT-2000PV	

SEMILAB PMR-3000 is an in-line monitoring unit for ion implantation monitoring use prior to the thermal annealing process step.

PMR-3000

WT-2020

The SEMILAB FAaST 330 is an electrical metrology system that uses non-contact methods to measure the properties of materials. It combines two patented techniques, known as Micro and Macro corona-Kelvin methods, into one platform. This system is designed to support both advanced research and development and high-volume manufacturing environments. The FAaST 330/230 DSPV systems provide fast, non-contact monitoring of heavy metal contamination in wafers, with the ability to detect even very low levels of contamination. The FAaST 330/230 C-V / I-V systems use advanced measurement techniques to provide non-contact imaging of dielectric and interface properties on monitor wafers. These systems include automated wafer handling and are suitable for medium to high-volume manufacturing environments. 

FAAST 330

The MCV automatic mapping systems provide a Mercury C-V measurement for non-patterned wafers used in epitaxial silicon production and front-end semiconductor processing.

MCV 2500

The SEMILAB FAaST 200 SL is a Wafer Mask Inspection system. The FAaST 200 SL can produce wafer size of 8” and Measurements can be made in scribe line test sites or in the active cell area. Cell measurements allow for the first time in-line electrical monitoring of topology related processing issues

FAAST 200 SL

RT-110

Microspot Spectroscopic Ellipsometer

Microspot spectroscopic ellipsometer of Semilab are capable of fully automated characterization of patterned, compound or (O)LED 300mm samples. 

Primary applications:
- Front-end applications
- Production wafer monitoring
- Process development
- Advanced Process Control:
- Across wafer uniformity
- Wafer to wafer uniformity
- Batch to batch uniformity

SE-3000

SRP-2100

IR 3100S

RT 1000

Laser Ellipsometer For Silicon Solar Cells

LE-103PV

PS-2000	

WT-2000

SRP-2100i

GES5E

SE-1000

-Wafer handling: Robot up to 300 mm
-Inspected area: Full sheet wafers
-Probes: 4PP (FEOL & BEOL) , EDDY (BEOL) , JPV (FEOL)
-1-4 permanent 4PP heads for different ranges & applications, Lower CoO
-Implant dose range: 1012 to 5×1015 1/cm2
-Cleanroom class: class 1 minienvironment

RT-3000

SRP-170

5130

The SEMILAB MCV-530 is a system designed for fast and reliable testing of dielectric and epitaxial layers using a mercury probe. It is ideal for research and development or small volume production. The MCV-530/530L systems are manual loading measurement equipment, but they have the same measurement capabilities as the automatic MCV-2200/2500 products. The MCV-530L can handle full wafers from 50 mm to 200 mm, while the MCV-530 can handle full wafers from 50 mm to 300 mm. Both systems can also handle coupon samples or fractions with a minimum sample size of 40 mm x 40 mm.
Manual loading systems, however they have the same measurement abilities like the automatic MCV-2200/2500 product.

MCV 530

ACV 3000

FAAST 210E-SPV

metrology system - Spreading Resistance Profiling

SRP-2000

The SEMILAB FAAST 350 is a Mask & Wafer Inspection tool designed to provide fast, non-contact monitoring of heavy metal contamination, including the detection of sub 108 atoms/cm-3 Fe. It features automated wafer handling from dual FOUP loadport loading stations and is fully capable of supporting high-volume manufacturing environments. This tool is world-leading in its ability to quickly and accurately monitor heavy metal contamination in wafers, making it an essential tool for ensuring the quality and reliability of semiconductor products.

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