VEECO

VIC MS50HS

RF351 C2 IBE

K475

NEXUS IBE 350I

RealTemp 200

XRF 4200

Veeco’s Propel™ MOCVD system is designed as a flexible platform for early stage research and development and small production needs for nitride applications. The reactor is capable of processing 9×2”, 3×4”, 1×6” and 1×8” on various substrates such as silicon, sapphire and silicon carbide without any hardware modification between runs.The system deposits high-quality GaN films for multiple applications such as power, RF, & photonics. The R200 reactor is based on Veeco’s leading TurboDisc® design including the IsoFlange™ and SymmHeat™ technologies that provide laminar flow and uniform temperature profile across the entire wafer. Customers can easily transfer processes from Veeco D180, K465i™ or MaxBright™ systems to the Propel GaN MOCVD platform.

Propel

VS 300

Fiji G2

FPP 100

XRF 300 AT

The new Lancer™ Ion Beam Etch (IBE) System was designed for the development and production of next generation electronic devices found in smartphones, self-driving automobiles and other ‘internet-of-things’ devices that enable connectivity, functionality and mobility.

Lancer

FCA / IBD

7760

IBD 350

SPECTOR is a large area ion beam deposition system designed for optical coating. It combines the high quality of ion beam film with the ability to handle batch sizes similar to those of e-beam systems. This system offers several advantages, including material uniformity across 400mm planets, which ensures maximum product yield. The high current RF ion sources provide excellent deposition rates, and the system offers maximum product flexibility through its support for large substrates and palettes.

SPECTOR

EPIK700

MS-12

M3302-8

RF350 C2 IBD

MS-50

XRF 5000

X-Ray Fluorescence Thickness and Composition Measurement Tool

SYSTEM XR

MS-40

AFM D 3100S-2

DEKTAK OPS-1100

UVX310

Dimension Vx 210

VE  400

DEKTAK I

X 1D

VE 401

he Dektak 3 Surface Profilometer is an instrument to measure the vertical profile of samples, thin film thickness, and other topographical features, such as film roughness or wafer bowing.
A diamond stylus is moved vertically into in contact with the sample and then moved laterally across the sample for a specified distance and specified contact force. The instrument can measure small surface variations in vertical stylus displacement as a function of position. The Dektak profilometer can measure small vertical features ranging in height from 100 Å to 650,000 Å on a 5″ Diameter Sample Stage.

DEKTAK 3

RuCVD

ADS 800

DLC 350V

DIMENSION V

XRF 5100L

XRF 330

XRF 4100

XRF 5400L

PHOENIX

DI3100

VE 7761

The Phoenix® system is engineered for high throughput and maximum uptime in any fabrication environment, from pilot production to industrial-grade manufacturing. Technologists and researchers rely on the Phoenix® for repeatable, highly accurate film deposition on flat and 3D substrates alike. And with support for up to six individual precursor lines, the Phoenix® delivers solid, liquid, or gaseous process chemistries depending on your thin film needs. A compact footprint and innovative design makes the Phoenix® the practical choice for those with batch production ALD requirements.

Phoenix G4

DUVX-210

XRF 5200H

Propel HVM 

XRF 4250L

M3400ML

The Veeco DLC-X system is a state-of-the-art tool for depositing thin, durable diamond-like carbon films, ideal for TFMH slider overcoats and landing pads. It features the industry's first production-worthy Pulsed Filtered Cathode Arc Source, enabling ultra-thin overcoats with exceptional uniformity and repeatability. This system combines long throw, low pressure PVD for dense, pin-hole free layers, a reactive PVD capability, and a tunable low-energy ion beam etch source for precise material removal. Additionally, its integrated tilting ellipsometer ensures accurate end point control in etch and deposition processes.

DLC-X

TURBODISC ENTERPRISE 300 II

**Parts**

VCE CM 350

VCE PVD-1

The Veeco Optium ADS-160 is a high-precision, ESD-safe dicing system for thin film magnetic head wafers, featuring a SEMI-S22 standard compliant platform, gang blade capability, automated bar handling, and a high-speed axis with multiple spindles. It has a rigid structure with a cutting area up to 350mm, includes open programming with a Windows GUI and touchscreen, and is designed for automation integration. Developed by a leader in TFMH process tools, it enhances productivity and precision in wafer dicing.

ADS-160

VE 775

WaferStorm M3303-7

The TurboDisc K465i GaN MOCVD System is a production-proven system that provides high productivity for HB LED high-volume production fabs around the globe. It is known for its highest productivity and best-in-class yields. The K465i achieves up to 90% yield (5nm bin) due to its superior uniformity and excellent run-to-run repeatability. It also offers high productivity due to its full automation and shortened recovery period after maintenance.

K465i

K465

E300

IBE C-1

The RF-350 is an automatic, single-substrate, loadlocked production system that uses a 300mm diameter, inductively coupled ion source for large substrates. It is similar to the RF-210 in that it provides excellent uniformity from its inductively-coupled, highly-collimated, filamentless, RF ion source during RIBE or ion milling. The RF-350 offers maximized process flexibility due to its reactive gas capabilities and independent control of ion beam parameters and ion incident angle. Additionally, its modular design allows for a seamless and cost-effective upgrade from single substrate, loadlock processing to cassette-to-cassette loading. This makes the RF-350 a versatile and efficient tool for substrate processing.

RF-350

FPP 5000

MS 35T

IBE 350

D9000

Dimension 8000

MaxBright

The Dimension 5000 Scanning Probe Microscope (SPM) is an advanced tool designed for semiconductor and data storage device manufacturers. It is capable of measuring up to one hundred areas on samples as large as 350 mm in diameter. The Dimension 5000 SPM is equipped with a wide range of atomic force microscopy (AFM) and scanning tunneling microscopy (STM) techniques, allowing it to detect faults, measure roughness, and analyze other features in three dimensions. One of the key advantages of the Dimension 5000 SPM is that it can perform these measurements without destroying, pretreating, or modifying the sample. This makes it an ideal tool for manufacturers who need to quickly and accurately analyze their products.

DIMENSION 5000

The WaferStorm platform is the industry choice for a number of critical solvent-based processes in the advanced packaging, MEMs, RF, Data Storage and Photonics markets. There are 2 versions- the Manual Load (ML) and 3300 series platforms. The ML system is well suited for R&D and pilot environments. The 3300-series platform is the high-volume work horse of the industry.

WaferStorm

E450

MICROETCH

CVC CX6

V200

DIMENSION 7000

The Veeco DEKTAK 3030 is a surface profile measuring system designed for measuring the surface profiles of surfaces such as wafers and microelectronic devices. It is capable of measuring surface profiles with a resolution of 0.1 nanometers and a vertical accuracy of 0.25 nanometers. It is also capable of measuring high aspect ratios and precision features. The system uses a stylus-based probe to measure the surface profile, with a stylus force of 0.5 to 5.0 milliNewtons. The system can also be used for measuring surface flatness, surface roughness, and other surface parameters.

VEECO

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