説明
Rework target L/S 10um or above; maximum copper foil thickness <70um; PCB MAX 660×610 mm; laser type YAG LASER, wavelength 532 nm, high-energy shaping, near-vertical irradiation, processing spot diameter 3 µm. Function Description: Uses laser irradiation to remove short circuits and residual copper on advanced HDI and IC substrates, including CSP, FC-CSP, BGA, and FC-BGA applications. Even for high-density substrate circuit designs, Ultra PerFix 120 can complete precise rework within 1 minute. When analysis reaches 10 µm, scrap can be minimized as much as possible.構成
構成なしOEMモデルの説明
Ultra PerFix 120 automatically shapes excess copper defects down to 10μm resolution. The system delivers breakthrough capabilities for eliminating scrap by achieving perfect results in less than a minute on complex CSP, FC-CSP, BGA and FC-BGA designs.ドキュメント
ドキュメントなし
カテゴリ
AOI
最終検証： 3日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
58896
ウェーハサイズ：
不明
ヴィンテージ：
2015
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
KLA / ORBOTECH
ULTRA PERFIX 120
カテゴリ
AOI
最終検証： 3日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
58896
ウェーハサイズ：
不明
ヴィンテージ：
2015
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Rework target L/S 10um or above; maximum copper foil thickness <70um; PCB MAX 660×610 mm; laser type YAG LASER, wavelength 532 nm, high-energy shaping, near-vertical irradiation, processing spot diameter 3 µm. Function Description: Uses laser irradiation to remove short circuits and residual copper on advanced HDI and IC substrates, including CSP, FC-CSP, BGA, and FC-BGA applications. Even for high-density substrate circuit designs, Ultra PerFix 120 can complete precise rework within 1 minute. When analysis reaches 10 µm, scrap can be minimized as much as possible.構成
構成なしOEMモデルの説明
Ultra PerFix 120 automatically shapes excess copper defects down to 10μm resolution. The system delivers breakthrough capabilities for eliminating scrap by achieving perfect results in less than a minute on complex CSP, FC-CSP, BGA and FC-BGA designs.ドキュメント
ドキュメントなし