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KLA / ORBOTECH ULTRA PERFIX 120
    説明
    Rework target: L/S 10um or above. Maximum copper foil thickness <70um. PCB MAX 660×610mm. Laser type: YAG LASER, wavelength 532nm, high-energy shape, near-vertical irradiation, processing spot diameter 3µm. Function Description: Uses laser irradiation to eliminate short circuits and copper residue on advanced HDI and IC substrates, including CSP, FC-CSP, BGA and FC-BGA applications. Even for high-density substrate circuit designs, Ultra PerFix 120 can complete precise rework within 1 minute. When analysis reaches 10µm, scrap can be minimized.
    構成
    構成なし
    OEMモデルの説明
    Ultra PerFix 120 automatically shapes excess copper defects down to 10μm resolution. The system delivers breakthrough capabilities for eliminating scrap by achieving perfect results in less than a minute on complex CSP, FC-CSP, BGA and FC-BGA designs.
    ドキュメント

    ドキュメントなし

    verified-listing-icon

    検証済み

    カテゴリ
    AOI

    最終検証: 3日前

    主なアイテムの詳細

    状態:

    Used


    稼働ステータス:

    不明


    製品ID:

    58895


    ウェーハサイズ:

    不明


    ヴィンテージ:

    2013


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    同様のリスト
    すべて表示
    KLA / ORBOTECH ULTRA PERFIX 120

    KLA / ORBOTECH

    ULTRA PERFIX 120

    AOI
    ヴィンテージ: 2015状態: 中古
    最終確認3日前

    KLA / ORBOTECH

    ULTRA PERFIX 120

    verified-listing-icon
    検証済み
    カテゴリ
    AOI
    最終検証: 3日前
    listing-photo-bdfe20398e2c4e089eeb500d629ed760-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1980/bdfe20398e2c4e089eeb500d629ed760/3e73fa73dd5b453381f4ae6dad1c1df3_screenshot20260305104700_mw.png
    listing-photo-bdfe20398e2c4e089eeb500d629ed760-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1980/bdfe20398e2c4e089eeb500d629ed760/08fcfc06bcbc46e69a2630b1c44c7791_screenshot20260305104721_mw.png
    listing-photo-bdfe20398e2c4e089eeb500d629ed760-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1980/bdfe20398e2c4e089eeb500d629ed760/0d4fd8bd6c4e43e6bf20ad8f69762ab1_screenshot20260305104619_mw.png
    listing-photo-bdfe20398e2c4e089eeb500d629ed760-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1980/bdfe20398e2c4e089eeb500d629ed760/55a8776c034b4e988371b223e9f5e052_screenshot20260305104738_mw.png
    主なアイテムの詳細

    状態:

    Used


    稼働ステータス:

    不明


    製品ID:

    58895


    ウェーハサイズ:

    不明


    ヴィンテージ:

    2013


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    説明
    Rework target: L/S 10um or above. Maximum copper foil thickness <70um. PCB MAX 660×610mm. Laser type: YAG LASER, wavelength 532nm, high-energy shape, near-vertical irradiation, processing spot diameter 3µm. Function Description: Uses laser irradiation to eliminate short circuits and copper residue on advanced HDI and IC substrates, including CSP, FC-CSP, BGA and FC-BGA applications. Even for high-density substrate circuit designs, Ultra PerFix 120 can complete precise rework within 1 minute. When analysis reaches 10µm, scrap can be minimized.
    構成
    構成なし
    OEMモデルの説明
    Ultra PerFix 120 automatically shapes excess copper defects down to 10μm resolution. The system delivers breakthrough capabilities for eliminating scrap by achieving perfect results in less than a minute on complex CSP, FC-CSP, BGA and FC-BGA designs.
    ドキュメント

    ドキュメントなし

    同様のリスト
    すべて表示
    KLA / ORBOTECH ULTRA PERFIX 120

    KLA / ORBOTECH

    ULTRA PERFIX 120

    AOIヴィンテージ: 2015状態: 中古最終検証:3日前
    KLA / ORBOTECH ULTRA PERFIX 120

    KLA / ORBOTECH

    ULTRA PERFIX 120

    AOIヴィンテージ: 2013状態: 中古最終検証:3日前