説明
Semi-automatic Thermal Slide De-Bonder Thermal slide-off debonding Bottom IR lamp heating Chuck sizes: 8 inch Suitable for temporary bonded wafer stacks Recipe-controlled process Real-time process monitoring/logging (force, temperature, and position) 8 inch end effector available構成
構成なしOEMモデルの説明
The EVG805 is a semi-automated system for debonding of temporary bonded and processed wafer stacks consisting of a device wafer, carrier wafer and an intermediate temporary bonding adhesive. The tool either supports thermal or mechanical debonding. The thin wafer can be unloaded on a single substrate carrier for safe and reliable transport between tools.ドキュメント
ドキュメントなし
カテゴリ
Bonder/Debonder
最終検証： 20日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
144932
ウェーハサイズ：
8"/200mm
ヴィンテージ：
2010
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
EVGroup (EVG)
EVG805
カテゴリ
Bonder/Debonder
最終検証： 20日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
144932
ウェーハサイズ：
8"/200mm
ヴィンテージ：
2010
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Semi-automatic Thermal Slide De-Bonder Thermal slide-off debonding Bottom IR lamp heating Chuck sizes: 8 inch Suitable for temporary bonded wafer stacks Recipe-controlled process Real-time process monitoring/logging (force, temperature, and position) 8 inch end effector available構成
構成なしOEMモデルの説明
The EVG805 is a semi-automated system for debonding of temporary bonded and processed wafer stacks consisting of a device wafer, carrier wafer and an intermediate temporary bonding adhesive. The tool either supports thermal or mechanical debonding. The thin wafer can be unloaded on a single substrate carrier for safe and reliable transport between tools.ドキュメント
ドキュメントなし