2100 FC
カテゴリ
Bonders概要（Overview）
The Flip Chip Bonder Esec 2100 FC hS capable of running an extensive range of FC applications such as FCOL, FC‑MIS, FC‑SIP, FCCSP, FCBGA as well as emerging packages such as CSP-LED.
現在の掲載品
3
サービス
検査、保証、鑑定、ロジスティクス
The Flip Chip Bonder Esec 2100 FC hS capable of running an extensive range of FC applications such as FCOL, FC‑MIS, FC‑SIP, FCCSP, FCBGA as well as emerging packages such as CSP-LED.
3
検査、保証、鑑定、ロジスティクス
