説明
説明なし構成
-SOI version( de bonder or temporary bonder) -Load, unload stations, Genmark robot, cleaning station, bonding Station and inspection.OEMモデルの説明
The EVG805 is a semi-automated system for debonding of temporary bonded and processed wafer stacks consisting of a device wafer, carrier wafer and an intermediate temporary bonding adhesive. The tool either supports thermal or mechanical debonding. The thin wafer can be unloaded on a single substrate carrier for safe and reliable transport between tools.ドキュメント
ドキュメントなし
EVGroup (EVG)
EVG805
検証済み
カテゴリ
Bonders
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
55578
ウェーハサイズ：
不明
ヴィンテージ：
2000
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
EVGroup (EVG)
EVG805
カテゴリ
Bonders
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
55578
ウェーハサイズ：
不明
ヴィンテージ：
2000
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
説明なし構成
-SOI version( de bonder or temporary bonder) -Load, unload stations, Genmark robot, cleaning station, bonding Station and inspection.OEMモデルの説明
The EVG805 is a semi-automated system for debonding of temporary bonded and processed wafer stacks consisting of a device wafer, carrier wafer and an intermediate temporary bonding adhesive. The tool either supports thermal or mechanical debonding. The thin wafer can be unloaded on a single substrate carrier for safe and reliable transport between tools.ドキュメント
ドキュメントなし