説明
Package Grinder構成
構成なしOEMモデルの説明
2011 Developed the ultra high precision DFS8960 surface planer which supports 300 mm wafers. Fully-automatic surface planer for Φ300 mm wafers Φ300 mm 2 axes, 2 chuck tables Planarization Ultrahigh-precision planarization technology using a diamond bit The DISCO surface planer provides solutions for high-precision planarization of ductile materials such as metals, resins, and their composites as well as solutions for reducing bump height variation and surface roughness.ドキュメント
ドキュメントなし
DISCO
DFS8960
検証済み
カテゴリ
CMP
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
111735
ウェーハサイズ：
不明
ヴィンテージ：
2013
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
DISCO
DFS8960
カテゴリ
CMP
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
111735
ウェーハサイズ：
不明
ヴィンテージ：
2013
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Package Grinder構成
構成なしOEMモデルの説明
2011 Developed the ultra high precision DFS8960 surface planer which supports 300 mm wafers. Fully-automatic surface planer for Φ300 mm wafers Φ300 mm 2 axes, 2 chuck tables Planarization Ultrahigh-precision planarization technology using a diamond bit The DISCO surface planer provides solutions for high-precision planarization of ductile materials such as metals, resins, and their composites as well as solutions for reducing bump height variation and surface roughness.ドキュメント
ドキュメントなし