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APPLIED MATERIALS (AMAT) UVISION 5
    説明
    Brightfield inspection
    構成
    構成なし
    OEMモデルの説明
    The Applied UVision 5 wafer inspection system detects yield-limiting defects in the critical patterning layers of 22nm and below logic and memory devices. Applied also offers the Applied DFinder system, the first darkfield wafer inspection system to use DUV laser scanning to detect particles as small as 40nm in interconnect layers. The UVision® 5 system isa member of the UVision wafer inspection product family, supporting the same proprietary core technology of deep ultraviolet (DUV) laser illumination, with simultaneous dual channel [brightfield (BF) reflected light and grayfield (GF) scattered light] collection optics. The system exhibits new defect inspection capabilities on advanced patterning layers in both FEOL and BEOL applications for 2xnm production and beyond, addressing such technologies as ArF immersion lithography, double and quad patterning, and extreme ultraviolet layers. The UVision 5 system’s dramatically increased light density enables detection of 1xnm killer defects - some never captured before - resulting in a twofold improvement in killer defect capture rates. This, in turn, results in a more accurate and comprehensive defect Pareto that significantly improves statistical process control in the wafer fab. The platform’s unique GF detection architecture now captures more light to enable detection of defects in the range of 1xnm (approximately the width of up to five DNA strands). New imaging modes improve detection sensitivity to further increase UVision technology leadership in GF scanning. Novel image processing algorithms reduce wafer noise by up to 50% in various types of memory structures, contributing to a higher capture rate, especially on BEOL layers.
    ドキュメント

    ドキュメントなし

    APPLIED MATERIALS (AMAT)

    UVISION 5

    verified-listing-icon

    検証済み

    カテゴリ
    Defect Inspection

    最終検証: 60日以上前

    主なアイテムの詳細

    状態:

    Used


    稼働ステータス:

    不明


    製品ID:

    36869


    ウェーハサイズ:

    12"/300mm


    ヴィンテージ:

    2011


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    同様のリスト
    すべて表示
    APPLIED MATERIALS (AMAT) UVISION 5

    APPLIED MATERIALS (AMAT)

    UVISION 5

    Defect Inspection
    ヴィンテージ: 0状態: 中古
    最終確認14日前

    APPLIED MATERIALS (AMAT)

    UVISION 5

    verified-listing-icon
    検証済み
    カテゴリ
    Defect Inspection
    最終検証: 60日以上前
    listing-photo-915d2021dec943f4845899e8e95b976d-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    主なアイテムの詳細

    状態:

    Used


    稼働ステータス:

    不明


    製品ID:

    36869


    ウェーハサイズ:

    12"/300mm


    ヴィンテージ:

    2011


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    説明
    Brightfield inspection
    構成
    構成なし
    OEMモデルの説明
    The Applied UVision 5 wafer inspection system detects yield-limiting defects in the critical patterning layers of 22nm and below logic and memory devices. Applied also offers the Applied DFinder system, the first darkfield wafer inspection system to use DUV laser scanning to detect particles as small as 40nm in interconnect layers. The UVision® 5 system isa member of the UVision wafer inspection product family, supporting the same proprietary core technology of deep ultraviolet (DUV) laser illumination, with simultaneous dual channel [brightfield (BF) reflected light and grayfield (GF) scattered light] collection optics. The system exhibits new defect inspection capabilities on advanced patterning layers in both FEOL and BEOL applications for 2xnm production and beyond, addressing such technologies as ArF immersion lithography, double and quad patterning, and extreme ultraviolet layers. The UVision 5 system’s dramatically increased light density enables detection of 1xnm killer defects - some never captured before - resulting in a twofold improvement in killer defect capture rates. This, in turn, results in a more accurate and comprehensive defect Pareto that significantly improves statistical process control in the wafer fab. The platform’s unique GF detection architecture now captures more light to enable detection of defects in the range of 1xnm (approximately the width of up to five DNA strands). New imaging modes improve detection sensitivity to further increase UVision technology leadership in GF scanning. Novel image processing algorithms reduce wafer noise by up to 50% in various types of memory structures, contributing to a higher capture rate, especially on BEOL layers.
    ドキュメント

    ドキュメントなし

    同様のリスト
    すべて表示
    APPLIED MATERIALS (AMAT) UVISION 5

    APPLIED MATERIALS (AMAT)

    UVISION 5

    Defect Inspectionヴィンテージ: 0状態: 中古最終検証:14日前
    APPLIED MATERIALS (AMAT) UVISION 5

    APPLIED MATERIALS (AMAT)

    UVISION 5

    Defect Inspectionヴィンテージ: 2011状態: 中古最終検証:60日以上前
    APPLIED MATERIALS (AMAT) UVISION 5

    APPLIED MATERIALS (AMAT)

    UVISION 5

    Defect Inspectionヴィンテージ: 2011状態: 中古最終検証:60日以上前