説明
WI2250+HM200 The system allows defect inspection of whole and diced wafers up to 200mm, with macro inspection sensitivity in the pre- and post-dice inspection (i.e., front- and back-end) of high-brightness (HB) LEDs and MEMS wafers.構成
This tool is in good working condition with no missing parts or components, fully installed, and can be demonstrated.OEMモデルの説明
The ICOS WI-2250 system's automated optical inspection capabilities enable higher quality LED and MEMS products at increased yields. The new system will allow defect inspection of whole and diced wafers up to 200mm, with macro inspection sensitivity in the pre- and post-dice inspection (i.e., front- and back-end) of high-brightness (HB) LEDs and MEMS wafers.ドキュメント
ドキュメントなし
カテゴリ
Defect Inspection
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
57098
ウェーハサイズ：
不明
ヴィンテージ：
不明
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
KLA / ICOS
WI-2250
カテゴリ
Defect Inspection
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
57098
ウェーハサイズ：
不明
ヴィンテージ：
不明
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
WI2250+HM200 The system allows defect inspection of whole and diced wafers up to 200mm, with macro inspection sensitivity in the pre- and post-dice inspection (i.e., front- and back-end) of high-brightness (HB) LEDs and MEMS wafers.構成
This tool is in good working condition with no missing parts or components, fully installed, and can be demonstrated.OEMモデルの説明
The ICOS WI-2250 system's automated optical inspection capabilities enable higher quality LED and MEMS products at increased yields. The new system will allow defect inspection of whole and diced wafers up to 200mm, with macro inspection sensitivity in the pre- and post-dice inspection (i.e., front- and back-end) of high-brightness (HB) LEDs and MEMS wafers.ドキュメント
ドキュメントなし